Ibiden Company Limited

Liyi Chen

Satoru Kawai

Kenji Sakai

Hiroaki Kodama

Kensaku Nakashima

Shuichi Kawano

Takashi Kariya

Toshiki Furutani

Kazuhiro Yoshikawa

Yasuhiko Mano

Toru Nakai

A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

Printed wiring board and method for manufacturing the same

A printed wiring board includes a core substrate having opening, an electronic component device accommodated in the opening of the substrate and including inductor and passive components, a wiring structure connecting the inductor and passive components in the electronic device, a filler resin body filling space formed between the substrate and electronic device in the opening of the substrate, a first buildup layer including a first interlayer insulation layer on first surface of the substrate, a first conductive layer on the first insulation layer, and a first via conductor in the first insulation layer, and a second buildup layer including a second interlayer insulation layer on second surface of the substrate on the opposite side of the first surface of the substrate, a second conductive layer on the second insulation layer, and a second via conductor in the second insulation layer.

Printed circuit board, and method for manufacturing printed circuit board

A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a first via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a first conductive circuit formed on the second surface of the resin insulation layer, and a first via conductor formed in the opening and connecting the pad and the first conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

Method for manufacturing a printed wiring board

A method for manufacturing a printed wiring board including preparing a carrier, forming a metal layer on the carrier, forming an etching resist on the metal layer, forming a metal film from the metal layer underneath the resist by removing portion of the metal layer exposed through the resist and part of the metal layer contiguous to the portion of the metal layer and underneath the resist, forming a coating layer on side surface of the film and the carrier, forming a pad on the coating layer, removing the resist, forming a resin insulation layer on the film and surface of the pad, forming an opening reaching the surface of the pad in the insulation layer, forming a conductive circuit on the insulation layer, forming a via conductor connecting the circuit and the pad in the opening, removing the carrier from the film and coating layer, and removing the film.

[Subject Matter] To provide a method for manufacturing a wiring substrate where rigidity is enhanced in an insulative portion made by oxidizing aluminum. [Solution(s)] Aluminum oxide insulative portionis formed on aluminum plateas shown in FIG.(A) through anodic oxidation (FIG.(C)). Then, holes (nano-holes) () in aluminum oxideare filled with resin(FIG.(E)). Accordingly, the rigidity (strength) of insulative portionwill be enhanced and cracking will not occur during heat cycles. Also, the insulation reliability of aluminum oxide will increase, and short circuiting may be prevented at through holes(aluminum portions) separated by aluminum oxide

Wiring substrate and method for manufacturing wiring substrate

An optoelectronic wiring board includes a flex-rigid substrate and an optical communication unit. The flex-rigid substrate includes a flexible substrate provided with an electric wiring, and a pair of rigid sections provided on both sides of the flexible substrate. The pair of rigid sections each include a lamination formed of a conductive circuit and an insulating layer. The optical communication unit is made of a flexible material and has both end faces substantially perpendicular to its optical path of transmitting light. Both end portions of the optical communication unit are disposed and fixed on the rigid sections so that both end faces of the optical communication unit face an optical element mounting region provided on the rigid sections of the flex-rigid substrate.

Optoelectronic wiring board, optical communication device, and method of manufacturing the optical communication device

A printed wiring board and a method for manufacturing the same are provided. The printed wiring board includes a resin insulation layer having a first surface and a second surface opposite the first surface, and includes an opening for a first via conductor. An electronic-component mounting pad is formed on the first surface of the resin insulation layer. The electronic-component mounting pad includes a portion embedded in the resin insulation layer and a portion protruding from the resin insulation layer. The protruding portion covers the embedded portion and a portion of the first surface of the resin insulation layer that surrounds the embedded portion. A first conductive circuit is formed on the second surface of the resin insulation layer. A first via conductor is formed in the opening of the resin insulation layer and connects the electronic-component mounting pad and the first conductive circuit.

Printed wiring board and method for manufacturing printed wiring board

An interposer including: a substrate including a first layer and second layer, wherein the first layer and second layer are positioned parallel to each other; electrodes each having a concave-convex structure formed on each facing surface of the first layer and second layer of the substrate; a dielectric layer sandwiched between the electrodes which are formed on each facing surface of the first layer and second layer of the substrate; a first conductive part which vertically passes through the first layer of the substrate from a first outer surface of the substrate and is electrically connected to an electrode formed on a surface of the second layer of the substrate that faces the first layer of the substrate; and a second conductive part which vertically passes through the second layer of the substrate from a second outer surface of the substrate and is electrically connected to an electrode formed on a surface of the first layer of the substrate that faces the second layer of the substrate.

Interposer, a method for manufacturing the same and an electronic circuit package

This invention provides a small package board integrated with power supply capable of supplying a low level of voltage and high level of current to an IC while achieving a low height of its power supply. It becomes hard to saturate an inductor magnetically when the surface of a copper wire is coated with a magnetic layer, and the inductor can accordingly be provided with a sufficient degree of inductance. A multiplicity of inductors can be provided within a confined space by arranging a multiplicity of inductors in parallel, and by fixing them with resin so as to form an inductor array, thereby making it possible to divide a power supply. The number of power supply lines is increased by dividing the power supply so as to reduce the level of current in an individual power supply line, so that a high level of current can be supplied to an IC chip. Further, a distance between a power supply and the IC chip can be decreased by incorporating a power supply module into the package board so as to reduce generation of heat and curb a drop in voltage in the power supply line, thereby making it possible to supply a high level of current to the IC chip.

Package board integrated with power supply

An optical communication device is provided that includes a flex-rigid substrate including a flexible substrate provided with an electric wiring, and a pair of rigid sections provided on both sides of the flexible substrate. The pair of rigid sections each includes a lamination formed of a conductive circuit and an insulating layer. The optical communication device also includes optical communication means made of a flexible material and having both end faces substantially perpendicular to its optical path of transmitting, and a pair of optical elements having their respective optical functional portions that are mounted on the rigid sections of the flex-rigid substrate. Both end portions of the optical communication means are disposed and fixed on the rigid sections, and at least one of the end faces is optically coupled with at least one of the optical functional portions of the optical elements through a coupling optical element.

An optical and electrical circuit board includes a patterned electrical wiring and a micro convex lens. The micro convex lens is provided in at least one hole formed in the optical and electrical circuit board.

Growing community of inventors

Ogaki, Japan

Liyi Chen