Shennan Circuits Co., Ltd.

Lixiang Huang

Hua Miao

Zedong Wang

Jin Dong

The present disclosure provides an adapter board, a for manufacturing the same and a circuit board assembly. The adapter board includes a board body, a first component buried in the board body, a first connector located on a first surface of the board body and configured to be connected with a circuit board and a second component, a second connector located on a second surface of the board body and configured to be connected with a second component, a first conductive body and a second conductive body buried in the board body. One end of the first conductive body is connected with the first component. The other end of the first conductive body is connected with the first connector. One end of the second conductive body is connected with the first component. The other end of the second conductive body is connected with the second connector.

Adapter board, method for manufacturing the same and circuit board assembly using the same

Disclosed are an electronic component package, an electronic assembly, and a voltage regulation module. The electronic component package includes a substrate and a first electronic component. The substrate includes a first surface and a second surface; wherein the first surface is arranged with a first conductive layer, and the second surface is arranged with a second conductive layer. The substrate defines a first conductive hole connected to the first conductive layer and a second conductive hole connected to the second conductive layer. The first electronic component is received in the substrate and arranged with a first electrical connection terminal and a second electrical connection terminal; the first electrical connection terminal is connected to the first conductive layer through the first conductive hole, and the second electrical connection terminal is connected to the second conductive layer through the second conductive hole. The first electronic component is a passive electronic component.

Electronic component package, electronic assembly, voltage regulation module, and voltage regulator member

The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

Electronic component, voltage regulation module and voltage stabilizer

The invention, which relates to the technical field of circuit boards, specifically discloses a method for manufacturing an embedded circuit board, an embedded circuit board, and an application thereof. The method includes: providing a substrate, wherein an electronic component is embedded in the substrate, a pad is arranged on a side surface of the electronic component, and an end surface of the pad is flush with a same side surface of the substrate; forming a metallic layer on a side surface of the substrate adjacent to the pad by sputtering, evaporation, electroplating or chemical vapor deposition; and patterning the metallic layer to obtain a circuit board covered with the metallic layer on the pad, wherein the metallic layer on the pad protrudes beyond the same side surface of the substrate.

Method for manufacturing embedded circuit board, embedded circuit board, and application

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

Circuit board and method for manufacturing the same

The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

Embedded circuit board and method of manufacturing same

A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

Circuit board and manufacturing method thereof

The present disclosure relates to the technical field of circuit boards, and provides an embedded circuit board and a method for manufacturing the embedded circuit board. The embedded circuit board includes: a first outer wiring board, a base board, and a second outer wiring board. The base board has at least one groove, the first outer wiring board, the base board and the second outer wiring board define through holes to form a resonant chamber. A minimal distance between the side walls of the groove and the side walls of the adjacent through holes is 50 um-400 um. An electronic device is received in the groove.

Growing community of inventors

Shenzhen, China

Lixiang Huang