Aem, Inc.

Aem Components (Suzhou) Co., Ltd.

Liwu Wang

Daniel H Chang

Xiang-Ming Li

Jun Li

Jeffrey D Montgomery

Xiangming Li

Yonglin Yang

Yuling Zhai

Albert Tian

Zhong Zheng

Xiaopeng Yang

The present disclosure discloses a miniature super surface mount fuse, comprising: a fuse element provided with a low overload fusing point and at least two high breaking capacity fusing points connected in series with the low overload fusing point and respectively arranged on two sides of the low overload fusing point, at least two cavity plates provided with cavities, the low overload fusing point and the high breaking capacity fusing points being located at corresponding positions of the cavities; the present disclosure further provides a manufacturing method for a surface mount fuse; the miniature super surface mount fuse of the present disclosure can provide the protection for the civil consumer electronic circuit under various overload conditions without the occurrence of safety hazards such as smoking or cracking of the housing or explosion.

Miniature super surface mount fuse and manufacturing method thereof

An improved PTC device and method of manufacturing is disclosed. In one embodiment, the device and method incorporates an improved metal-ceramic composite PTC material manufactured by: (a) heating a ceramic material to a sufficiently high temperature to induce the ceramic material's PTC properties; (b) grinding the ceramic PTC material into a powder; (c) mixing the ceramic PTC material powder with a metal material powder so as to produce a metal-ceramic composite material powder; and (d) sintering the composite material powder at a temperature between 600&#xb0; and 950&#xb0; C. In alternative embodiments, an improved multi-layer structure and method of manufacturing such a structure is disclosed. In various embodiments, a PTC device made in accordance with the improved multi-layer structure and method of manufacture may or may not incorporate the improved metal-ceramic composite PTC material disclosed herein, but may use conventional ceramic-based PTC materials.

Multilayer positive temperature coefficient device and method of making the same

A composite fuse element includes a network or matrix of conductive material that is in contact and interspersed with arc suppressing materials at a particle level. In such a matrix, the conductive (e.g., metal) network and the arc suppressing material particles provides a large contact surface area between these materials. When the conductive network melts or vaporizes, the resulting conductive vapors are adsorbed into the arc suppressing particles in a short time due to the large contact area between conductive and arc suppressing materials and the short diffusion distance that the conductive vapors are required to travel before they are absorbed by the arc suppressing material.

Composite fuse element and methods of making same

A dense lead-free glass ceramic that has low dielectric constant and low dielectric loss for producing high-frequency ceramic devices, such as inductors and low temperature co-fired ceramics (LTCC), is disclosed. The glass ceramic consists of 15-35% by weight of lead-free borosilicate glasses with low softening point, 15-35% by weight of lead-free borosilicate glasses with high softening point, 20-80% by weight of combination of amorphous and crystalline SiO-filler (preferably 5-30% by weight of amorphous SiO, 10-50% by weight of crystalline SiO) and 0.1-10% by weight of at least one oxide of AlO, BaO, SbO, VO, CoO, MgO, BO, NbO, SrO and ZnO. The glass ceramic can be densified up to 99% of its theoretical density after firing and is co-firable with conductive metals between 800-900&#xb0; C. The dense glass ceramic has dielectric constant of 4.2-4.6 and loss tangent (tan &#x3b4;)&#x3c;0.0025 at 20 MHz and good thermal/mechanical strength for application in high frequency electronic devices.

Dense lead-free glass ceramic for electronic devices

Growing community of inventors

San Diego, CA, United States of America

Liwu Wang