Intel Corporation

Liwei Ju

David Zimmerman

Darshan Kobla

Joon-Sung Yang

Sankaran M Menon

Robert R Roeder

Self-repair logic for stacked memory architecture. An embodiment of a memory device includes a memory stack having one or more memory die elements, including a first memory die element, and a system element coupled with the memory stack. The first memory die element includes multiple through silicon vias (TSVs), the TSVs including data TSVs and one or more spare TSVs, and self-repair logic to repair operation of a defective TSV of the plurality of data TSVs, the repair of operation of the defective TSV including utilization of the one or more spare TSVs.

Self-repair logic for stacked memory architecture

Methods and apparatus for testing Input/Output (I/O) boundary scan chains for Systems on a Chip (SoCs) having I/Os that are powered off by default. Some methods and apparatus include implementation of boundary scan chain bypass routing schemes that selectively route a boundary scan chain path around I/O interfaces and/or ports that are powered off by default. Other techniques include selectively power-on I/Os that are powered off by default in a manner that is independent of SoC facilities for controlling the power state of the I/Os during SoC runtime operations. Various schemes facilitate boundary scan testing in accordance with IEEE Std.-1149.1 methodology.

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Austin, TX, United States of America

Liwei Ju