Monolithic Power Systems, Inc.

Chengdu Monolithic Power Systems Co., Ltd.

Liwei Hou

Junjian Zhao

Ze-Qiang Yao

Heng Li

Suwei Wang

Yu-Huei Lee

Zheng Luo

Tong Chen

Integrated circuit ('IC') unit and a wafer for fabricating IC units. The wafer has a first surface and a second surface opposite to the first surface. A redistribution metal layer may be formed on the first surface and may be patterned to have a redistribution metal layer pattern. A backside metal layer may be formed on the second surface and patterned to have a backside metal layer pattern so that the backside metal layer may be adapted to generate a backside stress on the wafer to at least partially offset a front side stress generated by the redistribution metal layer on the wafer.

Integrated circuit unit and wafer with integrated circuit units

A LED driving system for driving a LED matrix. The LED driving system includes an interconnection structure having a first surface and a second surface opposite to the first surface and a plurality of driver dies/chips attached to the first surface of the interconnection structure. The LED matrix is divided into a plurality of sub LED matrix sections that are attached to the second surface of the interconnection structure. The interconnection structure is configured to electrically couple each one of the plurality of sub LED matrix sections to a corresponding one driver die/chip in the plurality of driver dies/chips.

LED matrix driving system

Growing community of inventors

Chengdu, China

Liwei Hou