Hzo, Inc.

Other

Liulei Cao

Yang Yun

Tining Su

Blake LeRoy Stevens

Max Ernest Sorenson

Sean Owen Clancy

Bronwyn Cox

Protective coatings with one or more additives dispersed therethrough are disclosed. A protective coating may comprise a poly(p-xylylene), or parylene. An additive may be configured to cause the protective coating to contrast (e.g., visibly, etc.) with features or components that are exposed beyond a periphery of the protective coating. Additives that provide other characteristics are also disclosed. In addition, methods for applying protective coatings according to this disclosure are disclosed, as are inspection methods.

Incorporation of additives into protective coatings

Protective coatings are disclosed that are configured to cover electronic components within an electronic device, while enabling electrical connections to be established with electrical contacts that are covered by the protective coatings. Such a protective coating may comprise a parylene, or a poly(p-xylylene), protective coating that has a thickness of at least 0.1 &#x3bc;m and at most about 2 &#x3bc;m. Electronic devices that include such a protective coating are also disclosed.

Impermeable protective coatings through which electrical connections may be established and electronic devices including the impermeable protective coatings

In various aspects and embodiments, the present disclosure relates to the manner in which precursor materials are provided to processing equipment and, more specifically, to the manner in which precursor materials of organic polymers are delivered to systems for forming and, in some embodiments, depositing the organic polymers. In one aspect, the disclosure relates to precursor supplies, which comprise vehicles, such as binders, supports and cartridges, for delivering a precursor material to a material processing system, such as a deposition system or other processing equipment. In another aspect, the disclosure relates to material processing systems with which the precursor supplies are configured to be used. Methods for preparing precursor supplies, using precursor supplies, providing process control, and recycling precursor supplies are also disclosed.

Precursor supplies, material processing systems with which precursor supplies are configured to be used and associated methods

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Salt Lake City, UT, United States of America

Liulei Cao