Semiconductor Manufacturing International (shanghai) Corporation

Agora Lab, Inc.

Liu Yong

Tian Xia

Cui Yin

An apparatus for communication between a sending application and a receiving application of a receiving apparatus includes a processor that is configured to establish a stream for transmitting data between the sending application and the receiving application; receive a first request from the sending application to transmit metadata to the receiving application; receive a second request from the sending application to transmit application data to the receiving application; responsive to a determination that a frame that includes the application data and the metadata has a size that is smaller than or equal to a maximum frame size, construct the frame to include the application data and the metadata; and transmit the frame in a packet to the receiving apparatus.

Universal transport framework for heterogeneous data streams

An integrated circuit device structure (and methods). The structure includes a semiconductor substrate comprising a surface. A first doped polysilicon liner is defined within a first trench region formed on a first plug coupled to the surface of the substrate and a second doped polysilicon liner is defined within a second trench region on a second plug coupled to the surface of the substrate. The first trench region is separated from the second trench region by a predetermined dimension. The structure also has a first rugged polysilicon material overlying surfaces of the first doped polysilicon material within the first trench region and a second rugged polysilicon material overlying surfaces of the second doped polysilicon material in the second trench region. The first rugged polysilicon material is free from a possibility of electrical contact with the second rugged polysilicon material. An organic material is disposed completely within the first doped polysilicon liner and disposed completely within the second doped polysilicon liner to protect the first rugged polysilicon material and the second rugged polysilicon material overlying the respective surfaces of the first doped polysilicon liner and the second doped polysilicon liner.

Growing community of inventors

Shanghai, China

Liu Yong