National Semiconductor Corporation

Lisa V Rozario

Andy Strachan

Richard Orr

A test structure and testing method are provided for characterizing the time-dependent drift in the parasitic PFET leakage current that flows along the sidewall of a deep trench isolation structure from the P-type active area to the P-type substrate in a semiconductor integrated circuit structure. The capacitive coupling characteristics of the deep trench isolation structure are used to control the electrical 'bias' of the deep trench structure through the use of a large auxiliary trench mesh network that is formed as part of the deep trench structure. The trench mesh network can be placed adjacent to a Vdd ring or a ground ring and then, by using a ratioed capacitive voltage dividing network, the electrical potential at the trench can be controlled.

Electrical test structure and method for characterization of deep trench sidewall reliability

The trench leakage current of a deep trench isolation structure is measured. The deep trench isolation structure, which is filled with polysilicon, contacts both a first region of a first conductivity type and a second region of a second conductivity type, and is proximate to a third region of the first conductivity type formed in the second region. Test voltages are applied to the structures and the leakage current is measured.

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San Jose, CA, United States of America

Lisa V Rozario