Hewlett-Packard Development Company, L.p.

Hewlett-Packard Company

Lisa Heid Pallotti

Michael C Day

Christian Laszlo Belady

Eric C Peterson

Mark Edward Shaw

Shaun Lee Harris

Stuart C Haden

Rangaswamy Arumugham

Terrel L Morris

Gary Belgrave Gostin

Russ William Herrell

Paul T Artman

In one embodiment, a computer system, comprises at least a first computing cell and a second computing cell, each computing cell comprising at least one processor, a routing device to couple the first and second computing cells, a global clock signal source coupled to the at least two computing cells to generate a global clock signal, at least one timing manager to generate a timing control signal, wherein the at least two computing cells comprise a local oscillator to generate a local clock signal, and a multiplexer coupled to receive the global clock signal, the local clock signal, and the timing control signal, and to output one of the global clock signal or the local clock signal in response to the control signal.

Clock architecture for multi-processor systems

There is provided a method of operating a computer system. The computer system comprises at least two cabinets and the at least two cabinets have at least one clock signal. The method includes selecting one of the at least one clock signal to serve as a master signal, and synchronizing the computer system to operate from the master signal. Additionally, the method includes altering the capacity of the system while the system is operating.

System and method for distributing clock signals

A system and method for facilitating communications between a plurality of devices that communicate using different cache-line sizes are disclosed. Briefly described, in architecture, one exemplary embodiment of a compatible cache-line communication system employs a plurality of first ports, each first port configured to receive communications from a first type of device that uses a first cache-line size; and a plurality of second ports, each second port configured to receive communications from a second type of device that uses a second cache-line size, such that communications between the first type of devices are enabled over a plurality of first routes, such that communications between the second type of devices are enabled over a plurality of second routes, and such that communications between the first type of devices and the second type of devices are disabled.

Systems and methods for enabling communications among devices in a multi-cache line size environment and disabling communications among devices of incompatible cache line sizes

A circuit comprising multiple circuit boards is disclosed herein. An embodiment of the circuit may comprise first and second printed circuit boards. The first printed circuit board may comprise first and second conductive planes. The first conductive plane has a first shape and the second conductive plane has a second shape, wherein the first shape is substantially similar to the second shape. The first conductive plane is located adjacent the second conductive plane, wherein the first conductive plane is parallel to and aligned with the second conductive plane. The second printed circuit board is connected to the first printed circuit board.

Processor and power supply circuit

A high performance processor assembly is electrically connected to a power supply so as to minimize voltage variations associated with the supply of power to the processor assembly. The processor assembly is fabricated on a multilayered printed circuit board. Power is supplied to components on the printed circuit board by way of parallel and split power planes. The parallel and split power planes reduce inductance and increase capacitance associated therewith. The reduced inductance reduces voltage variations caused by load transient currents. Capacitors are electrically connected to the power planes by way of multiple vias to further reduce inductance.

The inventive system uses a backplane to interconnect a plurality of modular cell boards. Each cell board comprises a plurality of processors, a processor controller chip, a memory subsystem, and a power subsystem. The processor controller chip manages communications between components on the cell board. A mechanical subassembly provides support for the cell board, as well as ventilation passages for cooling. Controller chips are connected to one side of the backplane, while the cell boards are connected to the other side. The controller chips manage cell board to cell board communications, and communications between the backplane and the computer system. The cell boards are arranged in back to back pairs, with the outer most cell boards having their components extend beyond the height of the backplane. This allows for an increase of spacing between the front to front interface of adjacent cell boards.

Growing community of inventors

Plano, TX, United States of America

Lisa Heid Pallotti