Stmicroelectronics (crolles 2) Sas

Stmicroelectronics S.a.

Stmicroelectronics (rousset) Sas

Lionel Cadix

Hamed Chaabouni

Fabrice Casset

Pascal Ancey

Laurent-Luc Chapelon

Perceval Coudrain

Alexis Farcy

Yacine Felk

The integrated circuit comprises a support substrate having opposite first and second main surfaces. A cavity passes through the support substrate and connects the first and second main surfaces. The integrated circuit comprises a device with a mobile element, the mobile element and a pair of associated electrodes of which are included in a cavity. An anchoring node of the mobile element is located at the level of the first main surface. The integrated circuit comprises a first elementary chip arranged at the level of the first main surface and electrically connected to the device with a mobile element.

Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile element

A via connecting the front surface of a substrate to its rear surface, this substrate including a porous region extending from at least a portion of the periphery of the via, the via including outgrowths extending in pores of the porous region.

Electric via comprising lateral outgrowths

A via connecting the front surface of a substrate to its rear surface and having, in cross-section in a plane parallel to the surfaces, the shape of a scalloped ring.

Scalloped tubular electric via

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Grenoble, France

Lionel Cadix