Boe Technology Group Co., Ltd.

Boe Mled Technology Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Linxia Qi

Yuanda Lu

Haiwei Sun

Junjie Ma

Shanwei Yang

Jiawei Zhao

Zhijun Xiong

Jinpeng Li

Jian Li

Lingyun Shi

Ming Zhai

Pei Li

Teng Zhang

Zhiyuan Wang

Pengjun Cao

Zongying Shu

Pei Qin

A light-emitting diode chip, a display substrate and a manufacturing method thereof are disclosed. The light-emitting diode chip includes a first conductive type semiconductor layer, a light-emitting layer, at least two second conductive type semiconductor layers, and at least two first electrodes; the at least two second conductive type semiconductor layers are at a side of the light-emitting layer away from the first conductive type semiconductor layer, the at least two first electrodes are electrically respectively connected with the at least two second conductive type semiconductor layers. Orthographic projections of the at least two second conductive type semiconductor layers on the first conductive type semiconductor layer are spaced apart from each other, and orthographic projections of the at least two first electrodes on the first conductive type semiconductor layer are spaced apart from each other.

Light-emitting diode chip, display substrate and manufacturing method thereof

A light-emitting chip and a light-emitting substrate are provided. The light-emitting chip includes a base substrate and at least two sub-light-emitting chips disposed on a side of the base substrate, wherein each sub-light-emitting chip includes a first semiconductor layer, a second semiconductor layer and an light-emitting layer located between the first semiconductor layer and the second semiconductor layer which are stacked.

Light-emitting chip and light-emitting substrate

Disclosed are a backlight module and a display device. The backlight module includes: a substrate and light emitting devices disposed on a side of the substrate, where each of the light emitting devices includes a light emitting diode, and a first connecting weld leg and a second connecting weld leg disposed between the light emitting diode and the substrate; the backlight module further includes a reflective layer between the substrate and the light emitting diodes; and for a same light emitting device, an orthographic projection of the reflective layer on the substrate and an area between orthographic projections of the first connecting weld leg and the second connecting weld leg on the substrate have an overlapping area.

Backlight module and display device

Growing community of inventors

Beijing, China

Linxia Qi