University of California

North Carolina State University

Atotech Deutschland Gmbh

Zettacore, Inc.

Lingyun Wei

Werner G Kuhr

Jonathan S Lindsey

Steven Zhichao Shi

David F Bocian

Zhiming Liu

Robert S Loewe

Jen-Chieh Wei

Kisari Padmaja

Ignacio Sanchez

Embodiments of the present invention provide methods of treating a surface of a substrate. In one particular aspect, embodiments of the present invention provide methods of treating a surface of a substrate that promote binding of one or more metal elements to the surface. According to some embodiments of the invention, films are formed on any conducting, semiconductive or non-conductive surface, by thermal reaction of molecules containing reactive groups in an organic solvent or in aqueous solution. The thermal reaction may be produced under a variety of conditions. In another aspect, the present invention provides a printed circuit board, comprising: at least one substrate; a layer of organic molecules attached to the at least one substrate; and a metal layer atop said layer of organic molecules.

Methods of treating a surface to promote metal plating and devices formed

This invention provides redox-active molecules attached to polypodal (e.g., bipodal, tripodal, quadrapodal, pentapodal, etc.) tethers that can be used for attachment of the redox-active molecules to a substrate (e.g., an electrode). The tethered redox-active molecules are useful for the fabrication of memory devices.

Multipodal tethers for high-density attachment of redox-active moieties to substrates

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Englewood, CO, United States of America

Lingyun Wei