Dell Products Inc.

Lingyu Kong

Bhyrav M Mutnury

Jason Pritchard

Charles W Ziegler, Iv

Zhenli Liu

Qianwen Wang

An information handling system includes first and second differential pairs on a printed circuit board. The first differential pair includes first and second traces, and first and second sets of impedance compensation traces. The first impedance compensation traces are routed only on an inner-side of the first trace. The second impedance compensation traces are routed only on an inner-side of the second trace, and the first and second impedance compensation traces are substantially aligned. The second differential pair includes third and fourth traces and third and fourth sets of impedance compensation traces. The third set of impedance compensation traces are routed only on an inner-side of the third trace. The fourth impedance compensation traces are routed only on an inner-side of the fourth trace, and the third and fourth impedance compensation traces are substantially aligned.

Differential pair inner-side impedance compensation

An information handling system includes a printed circuit board. The printed circuit board includes first and second pads of a first differential pair, a hatched ground, and first and second traces of a second differential pair. The first and second pads of the first differential pair are routed a surface of the printed circuit board. The hatched ground routed within a first layer of the printed circuit board. The first and second traces of the second differential pair are routed below the first and second pads and the hatched ground within a second layer of the printed circuit board. The hatched ground dampens crosstalk between signals on the traces and signals on the differential pair pads.

Hatching ground under a pad in a printed circuit board

A circuit board may include a traditional via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board and a slotted via formed within the circuit board proximate to the traditional via, the slotted via comprising an opening through a first surface and a second surface of the circuit board and a layer of conductive material formed on interior walls of the opening.

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Shanghai, China

Lingyu Kong