Intel Corporation

Lingyan L Tan

Bin Liu

Yong She

John G Meyers

Mao Guo

A system in package and method of making as system in package are disclosed. The system in package has a substrate () with a plurality of passive devices () mounted thereon. A molding compound () envelopes the plurality of passive devices () to define a flat surface () substantially parallel to a surface of the substrate (). A plurality of integrated circuit dies () is coupled successively to the flat surface ().

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Shanghai, China

Lingyan L Tan