Han's Laser Technology Industry Group Co., Ltd.

Lingtian Diao

Xiaojun Zhang

Yunfeng Gao

Xiao Liu

Jiangang Yin

Jiangang Tang

Jiangang Lu

Guodong Ma

Yuguo Peng

Xuerui Yuan

A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first COlaser beam the coating via a COfocusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second COlaser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second COlaser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.

Method and device for cutting sapphire

Growing community of inventors

Shenzhen, China

Lingtian Diao