Alpha & Omega Semiconductor Corporation

Alpha and Omega Semiconductor (cayman) Ltd.

Alpha and Omega Semiconductor International LP

Vishay-siliconix

Alpha and Omage Semiconductor Inc.

Aplha and Omega Semiconductor Incorporated

Lingpeng Guan

Madhur Bobde

Anup Bhalla

Hamza Yilmaz

Karthik Padmanabhan

Yeeheng Lee

Jun Hu

John Chen

Jongoh Kim

Wenjun Li

Moses Ho

Lei Zhang

TingGang Zhu

Wilson Ma

Sik Lui

Hong Chang

Hongyong Xue

Jian Wang

Yongping Ding

Lingbing Chen

Daniel Ng

Bum-Seok Suh

Paul Thorup

Yiming Gu

Terence Huang

Yang Xiang

Sekar Ramamoorthy

Wayne F Eng

Kyle Terrill

Xiaobin Wang

Limin Weng

Ning Shi

Harsh Naik

Seokjin Jo

Wim Aarts

Yueh-Se Ho

Zhiqiang Niu

Long-Ching Wang

Jian Yin

Sitthipong Angkititrakul

Anup Bialla

Zhenyu Wang

Christopher Ben Bartholomeusz

An improved inverted field-effect-transistor semiconductor device and method of making thereof may comprise a source layer on a bottom and a drain disposed on a top of a semiconductor substrate and a vertical current conducting channel between the source layer and the drain controlled by a trench gate electrode disposed in a gate trench lined with an insulating material. A heavily doped drain region is disposed near the top of the substrate surrounding an upper portion of a shield trench and the gate trench. A doped body contact region is disposed in the substrate and surrounding a lower portion of the shield trench. A shield electrode extends upward from the source layer in the shield trench for electrically shorting the source layer and the body region wherein the shield structure extends upward to a heavily doped drain region and is insulated from the heavily doped drain region to act as a shield electrode.

Bottom source trench MOSFET with shield electrode

A method and device for temperature monitoring of a power transistor formed in a semiconductor die comprising are disclosed. A side of a temperature-sensing resistor disposed in the semiconductor die is coupled to a voltage input side of the power transistor. A controller coupled to a second side of the temperature-sensing resistor is configured to detect a voltage across the resistor and trigger a temperature related corrective action using the detected voltage.

Method and circuit for sensing MOSFET temperature for load switch application

An apparatus comprising an insulated gate bipolar transistor and a super junction metal-oxide semiconductor field effect transistor wherein the insulated gate bipolar transistor and the super-junction metal-oxide semiconductor field effect transistor are electrically and optionally structurally coupled.

IGBT light load efficiency

A semiconductor device includes a semiconductor body having a base region incorporating a field stop zone where the base region and the field stop zone are both formed using an epitaxial process. Furthermore, the epitaxial layer field stop zone is formed with an enhanced doping profile to realize improved soft-switching performance for the semiconductor device. In some embodiments, the enhanced doping profile includes multiple doped regions with peak doping levels where a first doped region adjacent to a first side of the field stop zone has a first peak doping level that is not higher than a last peak doping level of a last doped region adjacent to the base region. The epitaxial layer field stop zone of the present invention enables complex field stop zone doping profiles to be used to obtain the desired soft-switching characteristics in the semiconductor device.

Semiconductor device incorporating epitaxial layer field stop zone

Transistor device and method of making thereof comprising a substrate heavily doped with a first conductivity type and an epitaxial layer lightly doped with the first conductivity type on top of the substrate. A body region doped with a second conductivity type is formed in the epitaxial layer wherein the second conductivity type is opposite the first conductivity type and a source region doped with the first conductivity type is formed in the body region of the epitaxial layer. An integrated planar-trench gate having a planar gate portion is formed on the surface of the epitaxial layer that is contiguous with a gate trench portion formed in the epitaxial layer.

Integrated planar-trench gate power MOSFET

A lateral super junction JFET is formed from stacked alternating P type and N type semiconductor layers over a P-epi layer supported on an N+ substrate. An N+ drain column extends down through the super junction structure and the P-epi to connect to the N+ substrate to make the device a bottom drain device. N+ source column and P+ gate column extend through the super junction but stop at the P-epi layer. A gate-drain avalanche clamp diode is formed from the bottom the P+ gate column through the P-epi to the N+ drain substrate.

Sawtooh electric field drift region structure for planar and trench power semiconductor devices

A method for manufacturing and a Super Junction MOSFET are disclosed. The Super Junction MOSFET comprises a lightly doped epitaxial layer of a first conductivity type on a heavily doped substrate of the first conductivity type. A deep trench is formed in the epitaxial layer. The deep trench having an insulating layer with a thickness gradient formed on surfaces of the deep trench. One or more regions of the epitaxial layer proximate to sidewalls of the deep trench is doped of a second conductivity type, wherein the second conductivity type is opposite the first conductivity type. Finally, MOSFET device structures are formed in the epitaxial layer.

Gas dopant doped deep trench super junction high voltage MOSFET

A method for forming a superjunction power semiconductor device includes forming multiple epitaxial layers of a first conductivity type on a semiconductor substrate and implanting dopants of a second conductivity type into each epitaxial layer to form a first group of implanted regions in a first region and a second group of implanted regions in a second region in each epitaxial layer. The multiple epitaxial layers are annealed to form multiple columns of the second conductivity type having slanted sidewalls across the first to last epitaxial layers. The columns include a first group of columns formed by the implanted regions of the first group and having a first grading and a second group of columns formed by the implanted regions of the second group and having a second grading, where the second grading is less than the first grading.

Method for forming super-junction corner and termination structure with graded sidewalls

Improving IGBT light load efficiency

A process is applied to develop a plurality of reverse conducting insulated gate bipolar transistors (RCIGBTs). The process comprises the steps of providing a wafer, applying a first grinding process, patterning a mask, applying an etching process, removing the mask, implanting N++ type dopant, applying a second grinding process forming a TAIKO ring, implanting P+ type dopant, annealing and depositing TiNiAg or TiNiVAg, removing the TAIKO ring, attaching a tape, and applying a singulation process. The mask can be a soft mask or a hard mask. The etching process can be a wet etching only; a wet etching followed by a dry etching; or a dry etching only.

Method of making reverse conducting insulated gate bipolar transistor

A superjunction power semiconductor device includes a termination region with superjunction structures having higher breakdown voltage than the breakdown voltage of the active cell region. In one embodiment, the termination region includes superjunction structures having lower column charge as compared to the superjunction structures formed in the active cell region. In other embodiments, a superjunction power semiconductor device incorporating superjunction structures with slanted sidewalls where the grading of the superjunction columns in the termination region is reduced as compared to the column grading in the active cell region. The power semiconductor device is made more robust by ensuring any breakdown occurs in the core region as opposed to the termination region. Furthermore, the manufacturing process window for the power semiconductor device is enhanced to improve the manufacturing yield of the power semiconductor device.

Super-junction corner and termination structure with graded sidewalls

A semiconductor device includes a semiconductor body having a base region incorporating a field stop zone where the base region and the field stop zone are both formed using an epitaxial process. Furthermore, the epitaxial layer field stop zone is formed with an enhanced doping profile to realize improved soft-switching performance for the semiconductor device. In some embodiments, the enhanced doping profile formed in the field stop zone includes varying, non-constant doping levels. In some embodiments, the enhanced doping profile includes one of an extended graded doping profile, a multiple stepped flat doping profile, or a multiple spike doping profile. The epitaxial layer field stop zone of the present invention enables complex field stop zone doping profiles to be used to obtain the desired soft-switching characteristics in the semiconductor device.

An apparatus comprising an insulated gate bipolar transistor; and a super-junction metal-oxide semiconductor field effect transistor wherein the insulated gate bipolar transistor wherein the super-junction metal-oxide semiconductor field effect transistor are structurally coupled and wherein the super-junction metal-oxide semiconductor field effect transistor is configured to switch to an 'on' state from an 'off' state and an &#x2018;off&#x2019; state from an &#x2018;on&#x2019; state.

Combined IGBT and superjunction MOSFET device with tuned switching speed

Trench MOSFET with self-aligned body contact with spacer. In accordance with an embodiment of the present invention, a plurality of gate trenches are formed into a semiconductor substrate. A body contact trench is formed into the semiconductor substrate in a mesa between the gate trenches. Spacers are deposited on sidewalls of the body contact trench. An ohmic body contact is implanted into the semiconductor substrate through the body contact trench utilizing the spacers to self-align the implant. A body contact trench extension may be etched into the semiconductor substrate through the body contact trench utilizing the spacers to self-align the etch, prior to the implant.

Trench MOSFET with self-aligned body contact with spacer

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San Jose, CA, United States of America

Lingpeng Guan