Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International (beijing) Corporation

Other

Texas Instruments Corporation

Polyone-shanghai, China

Cn.usa Biotech Holdings, Inc.

Werner Co.

Ling Zhu

Nan Li

Lilung Lai

Xiao Xun Zhang

Yong Wang

Jing Wang

Beverly Lubit

Liang He

Fang Chen

Jian Xu

Wenyu Shang

Xutong Han

Maolin Lu

The present disclosure provides, in part, a priming and boosting vector-based platform to develop vaccines against pathogens that is tailored to elicit a broad T cell response targeting conserved viral epitopes. The universal vaccines are prepared against an immunogen of an infectious pathogenic organism selected from a virus, a bacteria, a fungus or a protozoan comprising at least one ribonucleic acid (RNA) polynucleotide comprising an open reading frame encoding at least one polypeptide antigen or an immunogenic fragment thereof, wherein the polypeptide antigen, or the immunogenic fragment thereof, comprises a conserved internal protein that is enriched in CD8+ T cell recognition antigens. The effectiveness of the priming and boosting platform is tested in a humanized mouse model comprising a fully functional human immune system.

Universal vaccines against immunogens of pathogenic organisms that provide organism-specific and cross-group protection

An apparatus comprises a circuit board having a first conductive pad on a circuit board surface and a conductive overlay, which has a first surface and a second surface opposite the first surface and is configured to deflect in response to a touch on the first surface. A protrusion protrudes from the second surface and is configured to be a second conductive pad. The circuit board, the conductive overlay, and the protrusion are arranged such that the second surface faces the circuit board surface and is separated from the first conductive pad by a first distance. The protrusion and the first conductive pad are separated by a second distance and have an overlapping area. The apparatus may also comprise a spacer configured to separate the first conductive pad from the second surface by the first distance and from the protrusion by the second distance.

Capacitive touch sensor

A metal cabinet with electrically conductive hinges comprises a cabinet body and a cabinet door that are made of an electrically conductive metal. An LED luminous body is disposed in the cabinet door, and at least two electrically conductive hinges for enabling the cabinet door to rotate relative to the cabinet body are disposed between the cabinet door and the cabinet body. Each of the hinges comprises a first hinge body and a second hinge body. The first hinge body is connected to a first electrically conducts wire connecting the first hinge body to a power supply. A first outer insulation pad is disposed between the first hinge body and the cabinet body. The second hinge body is connected to a second electrically conductive wire connecting the second hinge body to the LED luminous body. A second outer insulation pad is disposed between the second hinge body and the cabinet door.

Metal cabinet with electrically conductive hinges

A composition to protect beta-carotene from visible light photo-oxidation is disclosed. The composition uses a combination of a quinophthalone dye, a pyrazolone dye, and a methine dye to protect the beta-carotene from visible light in the range of 400-500 nm.

Composition for protecting beta-carotene

A method is provided for fabricating a semiconductor testing structure. The method includes providing a substrate having a to-be-tested device structure formed on a surface of the substrate, a dielectric layer formed on the surface of the substrate and a surface of the to-be-tested structure, and conductive structures and an insulation layer electrically insulating the conductive structures formed on a first surface of the dielectric layer. The method also includes planarizing the conductive structures and the insulation layer to remove the conductive structures and the insulation layer until the first surface of the dielectric layer is exposed; and bonding the first surface of the dielectric layer with a dummy wafer by an adhesive layer. Further, the method includes removing the substrate to expose a second surface relative to the first surface of the dielectric layer of the dielectric layer and a surface of the to-be-tested device structure.

Semiconductor testing structures and semiconductor testing apparatus

Semiconductor testing structures and fabrication method thereof

Growing community of inventors

Shanghai, China

Ling Zhu