Intel Corporation

Ling Zheng

Zhen Zhou

Daqiao Du

James A McCall

Xiang Li

Tae Young Yang

Jun Liao

Tae-Young Yang

Guosong Lin

Kevin Stone

An apparatus is described. The apparatus includes an electro-mechanical interface having angled signal interconnects, wherein, the angling of the signal interconnects is to reduce noise coupling between the angled signal interconnects.

Packed interconnect structure with reduced cross coupled noise

Electrical interconnects having a non-linear conductive pathway, and related apparatuses and methods, are disclosed herein. In some embodiments, an electrical interconnect may include a non-linear conductive pathway electrically coupling top and bottom conductive portions. In some embodiments, an electrical interconnect may include a non-linear conductive pathway that propagates an electrical signal generating electromagnetic fields with an electrical field orthogonal to the direction of electromagnetic-wave propagation. In some embodiments, an electrical interconnect may include a non-linear conductive pathway portion and a linear conductive pathway portion. Also disclosed are connectors including an electrical interconnect having a non-linear conductive pathway. In some embodiments, a connector may include a first electrical interconnect having a non-linear conductive pathway generating first electromagnetic fields; and second electrical interconnect having a linear conductive pathway generating second electromagnetic fields that are orthogonal to the first electromagnetic fields.

Heterogeneous interconnect having linear and non-linear conductive pathways

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Chandler, AZ, United States of America

Ling Zheng