Honeywell International Inc.

Semiconductor Manufacturing International (shanghai) Corporation

Semiconductor Manufacturing International Corp.

Semiconductor Manufacturing International (beijing) Corporation

Rae Systems, Inc.

Shijiazhuang Sagacity New Drug Development Company, Ltd.

Medshine Discovery Inc.

Ling Liu

XiNing Wang

JenHao Cheng

Na Wei

Yuzhong Yu

Yan Mei Zhang

Qian Zheng

Shuhui Chen

Jian Li

Yan Zhang

Feng Liang

Yunfu Luo

Guoping Hu

Chundao Yang

Maoyi Lei

Jin Feng Gao

Qinghui Mu

Jianglin Jian

Fucheng Zhang

Various example embodiments described herein relate to a sensor assembly. The sensor assembly includes a first sensor cover and a second sensor cover. The first sensor cover is disposed on a first end of the sensor assembly and the second sensor cover is disposed on a second end of the sensor assembly. The first sensor cover defines a first capillary and the second sensor cover defines a second capillary therethrough. The sensor assembly further includes a first sensing unit, a second sensing unit, and a filter. The first sensing unit and the second sensing unit are disposed between the first sensor cover and the second sensor cover. In some example embodiments, the filter is reactive to a target gas and thereby prevents an inflow of the target gas through the second capillary into the sensor assembly.

Electrochemical gas sensor assembly

Embodiments relate generally to systems and methods for preventing reaction between a sealing material (epoxy) and an electrolyte material within a carbon monoxide (or other gas) sensor. In general, the electrochemical sensor disclosed herein comprises a gas diffusion working electrode, a counter electrode, and optionally, a reference electrode. Each electrode is in contact with an aqueous electrolyte. The gas sensor may comprise a tab located proximate to gaps in the housing of the sensor, wherein the tab prevents any sealing material that fills the gaps from entering the interior of the housing. In some embodiments, the tab may be attached to a counter electrode. In some embodiments, the housing may comprise a slot located about the gaps, wherein the tab fits into the slot of the housing.

Method for decreasing baseline under high temperature of gas sensor

Methods and systems for identifying contamination of an electrochemical sensor () and cleaning the electrochemical sensor () are provided. A method may comprise scanning the sensor () for the first time using CV to generate a reference set of readings; scanning the sensor () for the second time after the sensor () has been employed; comparing a second set of readings from the second CV scan to the reference set of readings; when the second set of readings is different from the reference set of readings, determining that the sensor () potential has shifted; scanning the sensor () for the third time to clean one or more elements of the sensor (); scanning the sensor () for the fourth time; comparing a fourth set of readings from the fourth CV scan to the second set of readings; and determining that the potential of the sensor () has shifted due to pollution of the sensor (), and/or that the sensor () can be further cleaned.

System and method for identifying and cleaning contamination of an electrochemical sensor

An electrochemical HS sensor comprises a housing, an electrolyte disposed within the housing, and a plurality of electrodes in contact with the electrolyte within the housing. The plurality of electrodes comprises a working electrode and a counter electrode. A surface area of the working electrode in contact with the electrolyte is less than a surface area of the counter electrode in contact with the electrolyte.

Electrochemical sensor

A gas detector includes an electrochemical gas sensor. The sensor includes a plurality of electrodes. At least one of the electrodes is formed of a catalyst/binder slurry which is halftone printed onto a substrate. The composite printed element and substrate are sintered to form the electrode.

Method of forming electrochemical gas sensor

An electrochemical hydrogen cyanide sensor () comprises a housing () comprising an opening () allowing gas to enter the sensor (); an electrolyte disposed within the housing (); a plurality of electrodes in contact with the electrolyte within the housing (), wherein the plurality of electrodes comprise a working electrode () and a counter electrode (), and wherein the electrodes comprise a metal catalytic material; and a filter () operable to cover the opening () of the housing (), and prevent hydrogen sulfide from reaching the electrodes, wherein the filter () comprises silver sulfate layered onto a polytetrafluoroethylene support material.

Electrochemical gas sensor for detecting hydrogen cyanide gas

Provided are a PDE4 inhibitor and a use thereof in the preparation of a medicament for treating PDE4 related diseases. Specifically disclosed are the compound as shown in formula (I) and a pharmaceutically acceptable salt thereof. 

PDE4 inhibitor

Disclosed is a balanced to unbalanced converter, which relates to the field of semiconductor technologies. The balanced to unbalanced converter includes a first spiral coil and a second spiral coil. The first spiral coil includes: multiple rings of first metal wires; and a second metal wire, which is located above the multiple rings of first metal wires and is connected to an innermost ring of the first metal wires using a conductive plug. The second spiral coil includes: multiple rings of third metal wires, adjacent third metal wires being separated by one ring of the first metal wires; and multiple rings of fourth metal wires that are located above the multiple rings of the third metal wires, each ring of the fourth metal wires being connected to one ring of the third metal wires by the conductive plug, a fourth metal wire closer to an outer ring being connected to a third metal wire closer to an outer ring, and a fourth metal wire closer to an inner ring being connected to a third metal wire closer to an inner ring. The second metal wire and the innermost ring of the first metal wires do not overlap in a vertical direction, and at least one of the multiple rings of the fourth metal wires and the third metal wire connected to the fourth metal wire do not overlap in the vertical direction.

Balanced to unbalanced converter

Electrochemical gas sensor

Semiconductor devices having a ground shield structure and methods for their formation are provided herein. An exemplary semiconductor device can include a substrate, a ground ring, a ground shield, an electronic device, and/or an insulation layer. The ground ring can be disposed over the substrate. The ground shield can be disposed over the substrate and surrounded by the ground ring. The ground shield can include a plurality of coaxial conductive wirings and a metal wire passing through the plurality of coaxial conductive wirings along a radial direction. The metal wire can be connected to the ground ring. The electronic device can be disposed over the ground shield. The insulation layer can be disposed between the ground shield and the electronic device.

Semiconductor device having ground shield structure and fabrication method thereof

Various embodiments provide inductor devices and fabrication methods. An exemplary inductor device can include a plurality of planar spiral wirings isolated by a dielectric layer. The planar spiral wirings can be connected by conductive pads formed over the dielectric layer and by conductive plugs formed in the dielectric layer. In one embodiment, a third planar spiral wiring can be formed over a second planar spiral wirings that is formed over a first planar spiral wiring. The third planar spiral wiring can be configured in parallel with the first third planar spiral wiring. The second planar spiral wiring can be configured in series with the first and third planar spiral wirings configured in parallel.

Method for fabricating inductor device

A patterned ground shield structure is provided. The patterned ground shield structure includes a substrate having a dielectric layer. The patterned ground shield structure also includes a plurality of conductive rings having a plurality of sub conductive rings in the dielectric layer. Further, the patterned ground shield structure includes an interconnection line connecting with all of the sub conductive rings in the dielectric layer. Further, the patterned ground shield structure also includes a ground ring connecting with the interconnection line.

Patterned ground shield structures and semiconductor devices

Various embodiments provide ground shield structures, semiconductor devices, and methods for forming the same. An exemplary structure can include a substrate and a dielectric layer disposed on the substrate. The structure can further include multiple conductive rings disposed in the substrate, in the dielectric layer, and/or on the dielectric layer. Each conductive ring of the multiple conductive rings can have openings of about three or more, and the openings of the each conductive ring can divide the multiple conductive rings into a plurality of sub-conductive rings arranged spaced apart. The structure can further a ground ring electrically connected to each of the plurality of sub-conductive rings.

Ground shield structure and semiconductor device

Inductor device and fabrication method

Various embodiments provide inductor devices and fabrication methods. In one embodiment, an inductor device can include a first dielectric layer disposed on a semiconductor substrate; a first planar spiral wiring disposed on the first dielectric layer, and optionally one or more second planar spiral wirings disposed over the first planar spiral wiring. Each of the first and the optional second planar spiral wirings can include a first spiral metal wiring and a second spiral metal wiring connected to the first spiral metal wiring. The second spiral metal wiring can include at least two sub-metal-lines isolated with one another.

Growing community of inventors

Shanghai, China

Ling Liu