Intel Corporation

Arizona State University

Ling Liao

David Hui

Andrew Alduino

Harel Frish

Judson D Ryckman

Ravindranath Vithal Mahajan

Haisheng Rong

Dean Samara-Rubio

Jeffrey B Driscoll

Saeed Fathololoumi

Yun-Chung Na

Ansheng Liu

Han-Din Liu

Quan Anh Tran

Donald Tiendung Tran

Srikant Nekkanty

Vladimir K Tamarkin

Kenneth Brown

Suresh V Pothukuchi

Assia Barkai

Mahesh Krishnamurthi

Oshrit Harel

Sushrutha Reddy Gujjula

David M Bond

Harinadh Potluri

Dexter W Hodge

Yoel Chetrit

Mario J Paniccia

James E Jaussi

Nitin A Deshpande

John Heck

Zuoguo Wu

John Tolle

Ganesh Balamurugan

John Kouvetakis

Remus Nicolaescu

Susheel G Jadhav

Hari Mahalingam

Syed S Islam

Meer Nazmus Sakib

Aliasghar Eftekhar

Hao Li

Duanni Huang

Jose Menendez

Taehwan Kim

Sushrutha Gujjula

Chaoxuan Ma

Joshua Keener

Bharadwaj Parthasarathy

David Patel

Yoel Shetrit

Thomas Liljeberg

Mohammad Montazeri Najafabadi

Sean McCargar

Shane Yerkes

Susheel Jadhav

David Bond

In one embodiment, an apparatus includes a processor, a laser, and a modulator. The processor is to generate a first electrical signal including first data and a second electrical signal including second data. The laser is to generate a multiplexed carrier signal comprising a first carrier signal and a second carrier signal, the laser to operate at a first laser power setting. The modulator is to generate a multiplexed optical signal including a first optical signal based in part on the first electrical signal and the first carrier signal and a second optical signal based in part on the second electrical signal and the second carrier signal. The apparatus is to transmit the multiplexed optical signal to a device and to retransmit the first data from the apparatus to the device based on a detection of error in a received version of the first data at the device. Other embodiments are described and claimed.

Apparatus, method, and system for performing error correction based on laser power setting

Embodiments described herein may be related to apparatuses, processes, and techniques related to packages that include CPUs and PICs electrically coupled via an interconnect bridge. In embodiments, the PIC are electrically coupled with the EMIB using a fan out RDL to extend reach of the PIC electrical connectors. EICs may be electrically coupled between the PIC and the interconnect bridge. The CPUs may be CPUS, graphical processing units (GPUs), field programmable gate arrays (FPGAs), or other processors. Other embodiments may be described and/or claimed.

Integrated photonics and processor package with redistribution layer and EMIB connector

The present disclosure is directed to photonic wavelength division multiplexing (WDM) receivers with polarization diversity and/or low reflectance. In embodiments, a WDM receiver is provided with a splitter, a plurality of waveguides and a plurality of photodetectors in series. The waveguides having particular equal path lengths relationship from the splitter to respective ones of the photodetectors. In other embodiments, the WDM receiver is provided with a splitter, a looped waveguide, a plurality of photodetectors, and a plurality of variable optical attenuators (VOAs). The VOAs are configured to suppress reflection of signal beams back to the transmitter. In various embodiments, the WDM receiver is a receiver sub-assembly of a silicon photonic transceiver disposed in a silicon package. Other embodiments may be described and/or claimed.

Photonic wavelength division multiplexing (WDM) receiver with polarization diversity and/or low reflectance

Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

Active bridge enabled co-packaged photonic transceiver

Embodiments of the present disclosure are directed to low numerical aperture (NA) optical couplers, or spot size converters, that include a lateral taper section and/or a vertical adiabatic taper section. In embodiments, the optical couplers may be positioned on a silicon substrate proximate to V-grooves within the substrate to contain optical fibers to self-align and to couple with the optical couplers. Other embodiments may be described and/or claimed.

Multi-layer silicon photonics apparatus

Disclosed herein are optical transceivers with multi-laser modules, as well as related optoelectronic assemblies and methods. In some embodiments, an optical transceiver may include: a first laser and a second laser; an optical output path, wherein an output of the first laser is coupled to the optical output path; and switching circuitry to decouple the output of the first laser from the optical output path and to couple an output of the second laser to the optical output path.

Optical transceivers with multi-laser modules

Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonics engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonics engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Dual-sided co-packaged optics for high bandwidth networking applications

Some embodiments of the present disclosure describe a tapered waveguide and a method of making the tapered waveguide, wherein the tapered waveguide comprises a first and a second waveguide, wherein the first and second waveguides overlap in a waveguide overlap area. The first and second waveguides have a different size in at least one dimension perpendicular to an intended direction of propagation of electromagnetic radiation through the tapered waveguide. Across the waveguide overlap area, one of the waveguides gradually transitions or tapers into the other.

Waveguide transition structure and fabrication method

Embodiments may relate to a transmission line to be coupled with an electromagnetic waveguide. The transmission line may include a signal node with a first contact, a second contact, and a via between first contact and the second contact. The transmission line may further include a ground node with a third contact, a fourth contact, and a via between the third contact and the fourth contact. Other embodiments may be described or claimed.

Multi-width transmission line

Embodiments of the present disclosure are directed toward techniques and configurations for an optical coupler. In some embodiments, the device may include an optical waveguide to transmit light input from a light source. The optical waveguide may include a semiconductor layer, having a trench with one facet that comprises an edge formed under an approximately 45 degree angle and another facet formed substantially normal to the semiconductor layer. The edge may interface with another medium to form a mirror to receive inputted light and reflect received light substantially perpendicularly to propagate the received light. Other embodiments may be described and/or claimed.

Optical coupler

A method and apparatus for high speed silicon optical modulation is described using a PN diode. In one example, an optical waveguide has adjoining first and second doped semiconductor regions. The first and second regions have opposite doping types and the first doped region extends in two perpendicular directions through the waveguide.

Method and apparatus for high speed silicon optical modulation using PN diode

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Santa Clara, CA, United States of America

Ling Liao