Huawei Technologies Co., Limited

Huawei Device Co., Ltd.

Huawei Device (dongguan) Co., Ltd.

Honor Device Co., Ltd.

Linfang Jin

Hao Sun

Lei Zhong

Hang Li

Jie Zou

Hualin Li

Xiangyang Yang

Jian Shi

Xiaowei Hui

Guoping Wang

Yongwang Xiao

Guo Yang

Zhi Yuan

Shaoxin Zhou

Jie Yang

Yongfu Sun

Shuainan Lin

Wenbing Tang

Nanbo Kang

Yan Xu

Menglong Zhao

Zhen Sun

Yaming Jiang

Zhen Xu

Qizhi Zhang

Yi Fang

Shuqiang Gong

Lan Li

Guzheng Wu

Mingxing Yang

Zhidong Tao

Taotao Zhou

Liechun Zhou

Hanru Yu

Qiu Chen

Naixiang Xu

Yonglu Liu

Jiaju Liu

Chenji Niu

Jinyan Hu

Huawen Jiang

Laili Feng

Guzhang Wu

Linghe Kong

Embodiments of this application provide a terminal device, including a middle frame, a heat source device, a first heat dissipation assembly, and a second heat dissipation assembly, where the first heat dissipation assembly is disposed on one side of the middle frame, the heat source device and the second heat dissipation assembly are disposed on the other side of the middle frame, and at least one of the first heat dissipation assembly and the second heat dissipation assembly is a graphene heat dissipation assembly.

Heat dissipation assembly for a terminal device

An example heat dissipation apparatus is connected to a heat sink. The example heat dissipation apparatus includes a first circuit board, a second circuit board, a support post, a main heat generation component, and a thermal conductive assembly. The second circuit board is located on a side of the first circuit board, and is spaced from the first circuit board. The support post is connected between the first circuit board and the second circuit board to form an air layer between the first circuit board and the second circuit board. The main heat generation component is mounted on the second circuit board. The thermal conductive assembly is connected between a second thermal conductive layer of the first circuit board and a third thermal conductive layer of the second circuit board.

Heat dissipation apparatus and electronic device

A temperature equalization component and an electronic device are disclosed. The temperature equalization component may include a housing and a capillary structure. The housing may include a cavity, and the capillary structure is located in the cavity and is disposed on a side of the housing that faces a heating element. The housing is provided with a first protrusion part and/or a first depression part, and the temperature equalization component is in direct contact with the heating element by using the first protrusion part and/or the first depression part, thereby improving heat transfer efficiency, reducing a probability that heat accumulates around the heating element, and improving a heat dissipation effect of the temperature equalization component.

Temperature equalization component and electronic device

A vapor chamber and a mobile terminal are provided. The vapor chamber comprises a first cover plate, a second cover plate, a housing including the first cover plate and the second cover plate, wherein the first cover plate and the second cover plate are connected to form a sealed cavity, a cooling medium, a capillary structure disposed in the sealed cavity, and a supporting structure extending from an inner surface of the housing to an internal space of the housing. A material of the first cover plate and the second cover plate is a high-strength composite material, wherein the high-strength composite material comprises a first material layer and a second material layer. The vapor chamber has light weight, small thickness and structural strength.

Mobile terminal, vapor chamber and preparation method thereof, and electronic device

Example mobile terminals are disclosed. One example terminal includes a rotating member, a flexible screen, a bending support part, and a temperature equalization plate. The flexible screen includes two unfolded regions and a bent region that is disposed opposite to the rotating member. The bending support part is located between the flexible screen and the rotating member. The temperature equalization plate is configured to balance temperatures in the two unfolded regions and includes two temperature equalization parts opposite to the two unfolded regions in a one-to-one correspondence and a flexible connection part that connects the two temperature equalization parts. The flexible connection part is located on a side of the bending support part and away from the flexible screen.

Mobile terminal accommodating flexible connection part

A heat conduction apparatus includes a first cover plate and a second cover plate. The first cover plate is hermetically connected to the second cover plate. The first cover plate is provided with a plurality of grooves. A supporting portion is formed between two adjacent grooves. A liquid circulation channel and a vapor circulation channel are formed in the groove. The liquid circulation channel is filled with a liquid working medium. The liquid circulation channel is communicated with the vapor circulation channel. The liquid working medium vaporizes into vapor. The vapor enters the vapor circulation channel and condenses into liquid. The liquid enters the liquid circulation channel.

Heat conduction apparatus and terminal device

An electronic device includes a heat emitting element disposed on a circuit board and a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1 degrees Celsius per Watt (&#xb0; C./W).

Electronic device

In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.

Circuit board, method for manufacturing circuit board, and electronic device

An electronic device includes a heat emitting element disposed on a PCB. The electronic device further includes a heat pipe group. The heat pipe group includes at least two heat pipes, and the heat pipe group is located on the heat emitting element. The heat pipes in the heat pipe group have at least one different characteristic parameter. Optimal working regions of the heat pipes in the heat pipe group are different. When the heat pipes in the heat pipe group work in the corresponding optimal working regions, thermal resistance ranges of the at least two heat pipes in the heat pipe group are 0.05-1&#xb0; C./W.

An electronic device comprises a heat dissipating layer disposed on a rear cover, a first shield cover and a second shield cover disposed on a mainboard, and a speaker box disposed on a surface of an antenna panel. The first region of the heat dissipating layer is in contact with the first shield cover, and the second shield cover is in contact with a first region of a middle frame; a second region of the heat dissipating layer is in contact with a surface of a battery, and the other surface of the battery is in contact with a second region of the middle frame, and a third region of the heat dissipating layer is in contact with a surface of the speaker box that is distant from the antenna panel, and the other surface of the antenna panel is in contact with a third region of the middle frame.

Heat dissipation structure for electronic device and electronic device

A heat conduction component and a mobile terminal are disclosed. The heat conduction component is applied to a mobile terminal. The heat conduction component includes a support part and a heat dissipation part. A cavity is disposed inside the support part. The heat dissipation part is disposed in the cavity, and the heat dissipation part has mesh capillary holes. The heat source component is located at one end of the heat dissipation part, a low temperature area is located at the other end of the heat dissipation part, and a temperature of the low temperature area is lower than a temperature of an area in which the heat source component is located. A heat conduction medium is disposed in the mesh capillary hole of the heat dissipation part.

Heat conduction component and mobile terminal

The present invention provides a heat dissipation assembly and an electronic device, where the heat dissipation assembly includes: a shielding element, where a via hole is disposed on the shielding element, the shielding element is electrically connected to ground copper of a PCB board, and a heat-generating electronic element is disposed on the PCB board; a heat pipe, located on the via hole, where the heat pipe is electrically connected to the shielding element, and the heat pipe, the PCB board, and the shielding element form an electromagnetic shielding can that is used to accommodate the heat-generating electronic element; and an elastic thermal interface material, disposed between the heat pipe and the heat-generating electronic element and mutually fitted to the heat pipe and the heat-generating electronic element.

Heat dissipation assembly and electronic device

A heat sink, which includes a first surface and a second surface opposite to the first surface, where the second surface includes a plurality of sub-surfaces, and each sub-surface is configured to be in contact with a surface of a heat emitting element; the plurality of sub-surfaces include a first sub-surface, a thickness between the first sub-surface and the first surface is less than a thickness between the first surface and each of the plurality of sub-surfaces except the first sub-surface; and the heat sink includes a plurality of layers of graphene sheets, each layer of graphene sheet includes a plurality of flake graphite particles, and two adjacent flake graphite particles located in a same layer of graphene sheet are covalently bonded.

Heat sink, preparation method therefor, and communications device

Growing community of inventors

Shenzhen, China

Linfang Jin