Motorola Corporation

Linda Limper-Brenner

Kevin J McDunn

Minoo D Press

Detlef W Schmidt

David T Tennant

Michael K Bullock

The device (,) includes a semiconductor die (,) positioned to receive a fluid cooling medium (,) and a power input lead (,) attached to the semiconductor die. The power input lead having a characteristic such that at a first temperature a first current flows between the semiconductor die and the power input lead and at a second temperature a second current flows between the semiconductor die and the power input lead.

Radio frequency electronic device and method for regulating an amount of power delivered to a radio frequency electronic device

The filter includes a housing (13) defining a cavity (14). The housing has a fluid inlet orifice (22) and a fluid ou let orifice (24) therein. At least one resonator (16), which is sized to receive and pass a radio frequency signal, is disposed in the cavity. A dielectric fluid (18) fills the cavity. The fluid inlet orifice is configured to supply a first quantity of the dielectric fluid to the cavity and the fluid outlet orifice is configured to remove a second quantity of the dielectric fluid from the cavity, so that the dielectric fluid is continuously replaced.

Radio frequency filter and apparatus and method for cooling a heat

According to an aspect of the present invention, the foregoing needs are addressed by a splicing tool for joining a first tube and a second tube, including a first member and a second member which are moveably coupled. The first member has a first handle section and a first mold section. The first mold section has a first groove. The second member has a second handle section and a second mold section. The second mold section has a second groove. The first groove sized to receive at least a portion of a first tube, at least a portion of a second tube and a bonding material. The bonding material attaches the first tube to the second tube when the first and second grooves are substantially aligned and heat is applied to the bonding material.

Splicing tool and method for joining a first tube and a second tube

The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).

Process for mounting an electronic component to a substrate and process

The apparatus includes a substantially planar plate having a first side and a second side. A plurality of substantially planar fluid distributing manifolds are formed in the first side of the plate, each fluid distributing manifold having a surface recessed relative to at least a portion of the first side of the plate. A nozzle housing is located in the surface of each fluid distributing manifold. The nozzle housing is adapted to receive a nozzle and has a receptacle end and a spray end. The spray end has an aperture, and is in communication with the second side of the plate. The receptacle end is in communication with the surface of one of the plurality of fluid distributing manifolds.

Apparatus for spray-cooling multiple electronic modules

The peristaltic pump includes a motor and an assembly driven by the motor. The assembly includes a rotating member, a retaining member having a slot, and a tubing advance pad sized to be substantially disposed in the slot, wherein in a first time interval the tubing advance pad is substantially disposed in the slot and the rotating member is configured to compress a tube along a path defined by the retaining member and at least a portion of the tubing advance pad, and in a second time interval the retaining member is configured to release the tubing advance pad from the slot, the tubing advance pad is coupled to the rotating member and the tube is prepared to advance from a first position to a second position.

Peristaltic pump and method in a peristaltic pump for advancing a tube

Apparatus and method for mounting an electronic component to a substrate

The apparatus includes a plate (10) having a first layer (12) and a second layer (14) opposed to the first layer (12). A first fluid distributing conduit (28) is disposed in the first layer (12) and a second fluid distributing conduit (28) is disposed in the second layer (14). A first nozzle housing (30) having a first aperture (36) is disposed in the first fluid distributing conduit (28) and a second nozzle housing (30) having a second aperture (36) is disposed in the second fluid distributing conduit (28).

Apparatus and method for spray-cooling an electronic module

The apparatus includes a cover (10) having a first surface (12) and a second surface (14) opposed to the first surface (12). The second surface (14) has an edge (16) defining a perimeter and has a recessed region (18). A wall (20) is in communication with the recessed region (18), the wall (20) and at least a portion of the edge (16) define a compartment (22). An electromagnetic interference-attenuating material (24) is disposed in the compartment (22), and a fluid distributing manifold (26) is disposed in the cover (10). A nozzle housing (30) sized to receive a nozzle is located in the fluid distributing manifold (26). The nozzle housing (30) has a receptacle end (32) and a spray end (34). The spray end (34) has an aperture (36) in communication with the compartment (22) and the receptacle end (32) is in communication with the fluid distributing manifold (26).

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Glenview, IL, United States of America

Linda Limper-Brenner