International Business Machines Corporation

Linda L Rapp

Richard W Adams

David R Clarke

Bernard Schwartz

Sarah Huffsmith Knickerbocker

Krystyna Waleria Semkow

Srinivasa S Reddy

Edward R Pillai

Gregory Blair Martin

Sara H Knickerbocker

Janet L Jozwiak

Replacements of thick film pads with smaller, thinner, metal contacts or straps are used to eliminate many of the stress-related failure modes associated with the larger contact pads. These straps allow for a more simplified manufacturing process than that associated with an anchored I/O pad configuration. A single via, electrically connected to a plurality of vias in a substrate layer above, is introduced to enhance the reliability of the signal net, and provides for higher frequency applications through reduction in parasitic capacitance and electrical leakage. The straps are directionally located toward the substrate center. Once the locations of the internal strap vias are redirected to lower local distance-to-neutral points, still within the same I/O capture pad, and directed towards the center of the substrate, single vias are then placed at the strap end closest the substrate center.

Enhanced high-frequency via interconnection for improved reliability

A semiconductor interconnect connection mechanism for attaching individual surface mounted semiconductor objects to multichip products whereby at least a portion of the electrical pathway between different objects on the top surface of surface mounted devices is not located on the top surface.

Interconnect structure for surface mounted devices

A ceramic material suitable for packaging of large scale integrated circuit is produced by the process of forming a mixture of a powdered glass ceramic material which is a glassy precursor to cordierite ceramic material, formed by the steps which are as follows:

Zirconia toughening of glass-ceramic materials

A ceramic material suitable for packaging of large scale integrated circuits is produced by the process of forming a mixture of a powdered glass ceramic material which is a glassy precursor to cordierite ceramic material, formed by the steps which are as follows:

Growing community of inventors

Poughkeepsie, NY, United States of America

Linda L Rapp