Schott Ag

Linda Johanna Bartelt

Sabine Pichler-Wilhelm

Martin Letz

Hauke Esemann

Martun Hovhannisyan

Frank Kroll

Julia Gold

Antonio Trizzino

Bernd Hoppe

Helmut Hartl

Andreas Roters

Ina Mitra

Ulf Dahlmann

Dieter Goedeke

Miriam Kunze

Martin Landendinger

Jörg Witte

Sabrina Wimmer

The disclosure relates to a glass and a melt solder for the passivation of semiconductor components, the use of the glass or the melt solder for the passivation of semiconductor components, a passivated semiconductor component and a method for passivating semiconductor components.

Glass and melt solder for the passivation of semiconductor components

The present disclosure relates to a bonding glass which has improved water resistance and has a coefficient of thermal expansion &#x3b1;(25-300) of from 14&#xb7;10Kto 17&#xb7;10K, comprising, in mol % on an oxide basis, 5-7 of BO, 10-14 of AlO, 36-43 of PO, 15-22 of NaO, 12.5-20 of KO, 2-6 of BiOand &#x3e;0-6 of R oxide, where R oxide is an oxide selected from the group consisting of MnOand SiOand SnOand TaOand NbOand FeOand GeOand CaO. The bonding glass is free of PbO except for, at most, impurities. The bonding glass may have a glass transition temperature Tg of from 390&#xb0; C. to 430&#xb0; C. The present disclosure also relates to uses of this bonding glass.

High-expansion bonding glass having improved water resistance and uses thereof

A feed-through, in particular a feed-through which passes through part of a housing, in particular a battery housing, for example made of metal, in particular light metal, for example aluminum, an aluminum alloy, AlSiC, magnesium, an magnesium alloy, titanium, a titanium alloy, steel, stainless steel or high-grade steel. The housing part has at least one opening through which at least one conductor, in particular an essentially pin-shaped conductor, embedded in a glass or glass ceramic material, is guided. The base body is, for example, an essentially annular-shaped base body and is hermetically sealed with the housing part such that the helium leakage rate is smaller than 1*10mbar l/sec.

Feed-through

Growing community of inventors

Landshut, Germany

Linda Johanna Bartelt