Lam Research Corporation

Linda Jiang

Tuan Anh Nguyen

Hong Shih

John Edward Daugherty

Armen Avoyan

Xuyen Pham

Diane J Hymes

David Wei

Shun Jackson Wu

Ren Zhou

Tony Luong

Sridharan Srivatsan

Yaobo Yin

Katgenhalli Y Ramanujam

Joseph P Simon

Anjun Jerry Jin

Systematic and effective methodology to clean capacitively coupled plasma reactor electrodes and reduce surface roughness so that the cleaned electrodes meet surface contamination specifications and manufacturing yields are enhanced. Pre-cleaning of tools used in the cleaning process helps prevent contamination of the electrode being cleaned.

Methodology for cleaning of surface metal contamination from electrode assemblies

A temperature controlling system for use in a chemical mechanical planarization (CMP) system having a linear polishing belt, a carrier capable of applying a substrate over a preparation location over the linear polishing belt is provided. The temperature controlling system includes a platen having a plurality of zones. The temperature controlling system further includes a temperature sensor configured determine a temperature of the linear polishing belt at a location that is after the preparation location. The system also includes a controller for adjusting a flow of temperature conditioned fluid to selected zones of the plurality of zones of the platen in response to output received from the temperature sensor.

Method and apparatus for heating polishing pad

Provided is a method for cleaning hydrophobic surfaces, such as low K dielectric organic or inorganic surfaces as well as metallization surfaces of a semiconductor wafer. The method includes: (a) applying a surfactant solution to the surface; (c) scrubbing the surface; and (c) spin-rinsing the surface of the substrate using de-ionized water to complete a removal of any contaminants from the surface. If needed, the surfactant solution can be mixed with a chemical enhancer, and the scrubbing can be performed in a brush system. The brush system may be configured to apply DI water using a through the brush (TTB) technique. The surfactant solution can be applied either using a drip technique or using the TTB technique.

Method and apparatus for cleaning low K dielectric and metal wafer surfaces

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Milpitas, CA, United States of America

Linda Jiang