International Business Machines Corporation

Linda Hope Lane

Robert Fontana

Celia E Yeack-Scranton

Mason Lamar Williams

Moris Musa Dovek

Edward Hin Lee

A disk drive assembly in which the suspension and read/write transducer are integrated into a combination assembly and fabricated using thin film deposition techniques thereby producing an assembly which is very low in mass permitting contact recording. In one embodiment, transducers are deposited in a row and column configuration onto a release and support layer covering a wafer substrate having a thickness equal to a desired suspension length. The wafer is separated into a plurality of row sections, with each row section providing one thin film transducer from each column. A second release layer is formed on a separated side on the row section and thin layers of suitable materials are deposited to form a suspension layer including conductive lines extending to the thin film transducers. The first and second release layers are dissolved and the row section is further cut to form the individual combination assemblies. In a second embodiment, the wafer substrate has a thickness equal to the width of the suspension. The transducers deposited on a row are separated by the desired suspension length to produce combination assemblies useful for linear disk drive actuators. The excess portion of the wafer substrate can alternatively be removed by cutting or etching eliminating the requirement for release or support layers.

Magnetic head for recording with ultra low force

A magnetoresistive (MR) head having a double self-aligned contiguous junction includes an MR sensor structure with a biased guide joined thereto. The guide is formed using a first resist mask applied over the MR sensor structure. A guide biasing structure is formed using the first resist mask and a second resist mask applied over the first resist mask and the guide. The first resist mask is configured to form a double self-aligned contiguous junction between the MR sensor structure and the guide and guide bias structure. In this manner, the position of the guide biasing structure is carefully controlled so that it does not overlap the MR sensor structure.

Double self-aligned insulated contiguous junction for flux-guided-MR or

A single point bonding tool for use in ultrasonically bonding a fine or ultrafine wire to another electrical conductor, has a thin film resistor integrally formed thereon. The thin film resistor is integrally formed on the bonding tip by standard photolithographic techniques applied to the bonding tool. The tool combines ultrasonic energy and thermal energy provided by the resistor to provide required bonding energy that may be localized both in space and in time. The result offers optimized energy transfer to the selected workpieces and minimizes risk of damage to adjacent, heat sensitive devices.

Growing community of inventors

Gilroy, CA, United States of America

Linda Hope Lane