University of Arizona

Leland Stanford Junior University

Linan Jiang

Kenneth E Goodson

Juan G Santiago

Thomas W Kenny

James C Mikkelsen

Daniel J Laser

Shulin Zeng

David E Huber

Chuan-Hua Chen

Evelyn Ning-Yi Wang

Lian Zhang

Jae-Mo Koo

Robert Andrew Norwood

Stanley K H Pau

Richard John Koshel

Stanley K Pau

Thomas L Koch

Roland Himmelhuber

Xuejiao Hu

Erfan M Fard

Kyungjo Kim

Methods, apparatus and systems that relate to high performance UV disinfection in a HVAC system with integrated concentrator optics are described. One example device for air disinfection includes a housing structured to include an interior volume and having an air inlet at a first end of the housing and an air outlet at a second end of the housing, the housing providing an air passage through the interior volume between the air inlet and the air outlet. The device filter includes at least one light source positioned proximate to the interior volume and at least one nonimaging optics element positioned proximate to the interior volume.

High performance ultraviolet disinfection in a heating, ventilation, and air conditioning system with integrated concentrator optics

A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board (OPCB) includes applying a coupling agent to a bonding surface of a flexible, freestanding polymer waveguide array film having at least one polymer waveguide disposed therein. The waveguide array film is placed onto the first and second photonic chips so that the waveguide array film extends over a gap and/or a step between the first and second photonic chips to thereby form a bonding interface between the bonding surface of the waveguide array film and the first and second photonic chips. The coupling agent is selected such that optical coupling between the first and second photonic chips arises simultaneously with formation of the bonding interface.

Assembly of flexible optical waveguides and photonic chips for optical interconnection packaging

A method for establishing optical coupling between spatially separated first and second planar waveguides includes arranging an optical interconnect on the first planar waveguide. The optical interconnect has first and second end portions and an intermediate portion. Each of the end portions has an inverse taper. The second planar waveguide is arranged on the optical interconnect so that the second planar waveguide overlaps with one of the inverse tapered end portions but not the other inverse tapered end portion to thereby enable an adiabatic transition of an optical signal from the first planar waveguide to the second planar waveguide via the optical interconnect. The first and second planar waveguides have different refractive indices at an operating wavelength and the optical interconnect have a higher refractive index at the operating wavelength than the refractive indices of a core of the first planar waveguide and a core of the second planar waveguide.

Chip-to-chip optical interconnection using high refractive index couplers

In accordance with a method of forming a waveguide in a polymer film disposed on a substrate, a plurality of regions on a polymer film are selectively exposed to a first dosage of radiation. The polymer film is formed from a material having a refractive index that decreases by exposure to the radiation and subsequent heating. At least one region of the polymer film that was not previously exposed to the radiation is selectively exposing to a second dosage of radiation. The second dosage of radiation is less than the first dosage of radiation. The polymer film is heated to complete curing of the polymer film.

High-throughput manufacturing of photonic integrated circuit (PIC) waveguides using multiple exposures

A photovoltaic ('PV') module may comprise an array of freeform micro-optics and an array of PV cells. The PV module may be a flat panel with a nominal thickness smaller than the length and width of the flat panel. An array of lenses may be embedded in an array substrate. The lenses may be coupled to light pipes. The lenses may concentrate light through the light pipes to multi-junction cells. Diffuse light may be transferred through the array substrate to a silicon cell. The lenses and light pipes may be manufactured using a molding and drawing process.

Micro-scale concentrated photovoltaic module

A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board includes applying a flexible, freestanding film onto the first and second chips so that the film extends over a gap and/or step between the chips. The film includes a photosensitive layer having a refractive index that decreases by exposure to radiation and a backing layer. The film is exposed to a flood exposure having a radiation dosage penetrating the backing layer and only a surface sublayer of the photosensitive layer. After curing the film, the backing layer is removed so that the photosensitive layer remains on the first and second chips. The photosensitive layer is selectively exposed to a second radiation dosage to define waveguide core(s) in unexposed regions of the photosensitive layer below the surface sublayer. The photosensitive layer is heated to cure the selectively exposed portions.

Fabrication of polymer waveguide interconnect between chips with a gap and/or step

A photovoltaic ('PV') module may comprise an array of freeform micro-optics and an array of PV cells. The PV module may be a flat panel with a nominal thickness smaller than the length and width of the flat panel. An array of lenses may be embedded in an array substrate. The lenses may be coupled to light pipes. The lenses may concentrate light through the light pipes to multi junction cells. Diffuse light may be transferred through the array substrate to a silicon cell. The lenses and light pipes may be manufactured using a molding and drawing process.

A thermal interface material (TIM) including a mechanically compliant matrix material which contains thermally conductive particles and thermally conductive nanofibers is provided. Such a TIM provides enhanced thermal conductivity without excessive viscosity when the nanofiber volume concentration is above a threshold value for enhanced thermal conductivity.

Composite thermal interface material including particles and nanofibers

Apparatus and methods according to the present invention utilize micropumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These micropumps are fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These micropumps also can allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the spatial and temporal characteristics of the device temperature profiles. Novel enclosed microchannel structures are also described.

Closed-loop microchannel cooling system

Apparatus and methods according to the present invention preferably utilize electroosmotic pumps that are capable of generating high pressure and flow without moving mechanical parts and the associated generation of unacceptable electrical and acoustic noise, as well as the associated reduction in reliability. These electroosmotic pumps are preferably fabricated with materials and structures that improve performance, efficiency, and reduce weight and manufacturing cost relative to presently available micropumps. These electroosmotic pumps also preferably allow for recapture of evolved gases and deposited materials, which may provide for long-term closed-loop operation. Apparatus and methods according to the present invention also allow active regulation of the temperature of the device through electrical control of the flow through the pump and can utilize multiple cooling loops to allow independent regulation of the special and temporal characteristics of the device temperature profiles. Novel microchannel structures are also described.

Growing community of inventors

Tucson, AZ, United States of America

Linan Jiang