Shanghai United Imaging Healthcare Co., Ltd.

Tyco Electronics (Shanghai) Co., Ltd.

Measurement Specialties (Chengdu) Ltd.

Chinese Academy of Sciences

Te Connectivity Corporation

Huazhong University of Science and Technology

Te Connectivity Services Gmbh

Commercial Aircraft Corporation of China, Ltd.

Commercial Aircraft Corporation of China, Ltd. Shanghai Aircraft Design and Research Institute

Te Connectivity Solutions Gmbh

Measurement Specialties, Incorporated

Tyco Electronics Co., Ltd.

Measurement Specialities (Chengdu) Ltd.

Lin Ye

Wei Wang

Yun Cao

Tao Ren

Jinpeng Jiang

Zhanqiang Kong

Yuyang Nie

Zhongkun Guan

Dandan Zhang

Lvhai Hu

Yun Liu

Yingcong Deng

Miao Zhang

Qinglong Zeng

Yong Yan

Roberto Francisco-Yi Lu

Lan Gong

Qian Ying

Feng Zhou

Zhongying Xue

Zengfeng Di

Tiejun Liu

Yingchun Chen

Junfeng Ge

Lijuan Feng

Roberto Francisco - Yi Lu

The present disclosure relates to a system and method for digital radiography. The system may include an X-ray generation module, an X-ray acquisition module, a control module, a support module and a power supply module. The system may include one or more moving components. The X-ray acquisition module may have different configurations, such as a vertical configuration, a horizontal configuration and a free-style configuration. The control module may be configured for controlling the motion of the moving components, the selection of an X-ray acquisition module of a specific configuration, and parameters of the X-ray exposure and image acquisition. The support module may include a system of guiding rails. The power supply module may include a capacitor.

System and method for digital radiography

The present disclosure relates to a system and method for digital radiography. The system may include an X-ray generation module, an X-ray acquisition module, a control module, a support module and a power supply module. The system may include one or more moving components. The X-ray acquisition module may have different configurations, such as a vertical configuration, a horizontal configuration and a free-style configuration. The control module may be configured for controlling the motion of the moving components, the selection of an X-ray acquisition module of a specific configuration, and parameters of the X-ray exposure and image acquisition. The support module may include a system of guiding rails. The power supply module may include a supercapacitor.

A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device is adapted to position and fix a circuit board having at least one pad. The first fixing device has a first positioning groove adapted to position the circuit board. The second fixing device is adapted to position and fix at least one wire. The second fixing device has at least one second positioning groove adapted to position the at least one wire. Each second positioning groove is aligned with a corresponding pad on the circuit board so that the wire in the second positioning groove is aligned with the corresponding pad on the circuit board.

Fixing apparatus

A fixing apparatus comprises a first fixing device and a second fixing device. The first fixing device has at least one first positioning groove adapted to position at least one first elongated member and fixes the at least one first elongated member. The second fixing device has at least one second positioning groove adapted to position at least one second elongated member and fixes the at least one second elongated member. Each first positioning groove is aligned with a corresponding second positioning groove so that the first elongated member fixed in the first positioning groove is axially aligned with the second elongated member fixed in the corresponding second positioning groove.

An icing detector probe includes three sections arranged sequentially along the direction of air flow, namely, a first section, a second section and a third section. The shape of the outer surface of the first section is suitable for collecting droplets in the air flow. The shape of the outer surface of the second section is suitable for full decelerating and releasing latent heat of large droplets during their movements. The outer surface of the third section is suitable for icing of large droplets. The probe detects icing by distinguishing and identify large droplets icing. The probe effectively detects types of traditional icing, thus being helpful for exact detection of icing thickness. An icing detector including said icing detector probe is also provided.

Icing detector probe and icing detector with the same

The present invention provides a method for preparing a GOI chip structure, where, in the method, first, a SiGe on insulator (SGOI) chip structure is made by using a SMART CUT technology, and then, germanium condensation technology is performed on the SGOI chip structure, so as to obtain a GOI chip structure. Because the SGOI made by the Smart-Cut technology basically has no misfit dislocation in an SGOI/BOX interface, the threading dislocation density of the GOI is finally reduced. A technique of the present invention is simple, the high-quality GOI chip structure can be implemented, and the germanium condensation technology is greatly improved. An ion implantation technology and an annealing technology are quite mature techniques in the current semiconductor industry, so that such a preparation method greatly improves the possibility of wide use of the germanium concentration technology in the semiconductor industry.

Method for preparing GOI chip structure

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Shanghai, China

Lin Ye