Cisco Technology, Inc.

Pensando Systems Inc.

Lin Shen

Yongming Xiong

Stephen S Ong

Shahbaz Mahmood

Mark Siechen

Maurilio Tazio De Nicolo

Timothy Conrad Lee

Li Li

Subbarao Arumilli

Randy J Bleske

Victor Odisho

Stephen Ong

Described herein are baffles for Input/Output (I/O) devices and I/O devices comprising baffles configured to redirect incoming pre-heated air around downstream electrical components and/or their respective heat sinks to prevent overheating. Providing an isolated fresh airflow path from a fluid inlet to such downstream electrical devices reducing such overheating, which prevents malfunctions and increases the I/O efficiency, speed, and lifetime of I/O devices.

Methods and systems for thermal control

The subject technology provides a method and apparatus for performing dual track routing. A pair of signal traces is routed in between two rows of contacts and at least one of the signal traces is modified to satisfy a routing restriction. The modification of the signal trace includes three trace segments that deviate the signal trace away from the source of the routing restriction.

Techniques for optimizing dual track routing

A method and apparatus for matching the lengths of traces of differential signal pairs. The method includes determining that a first trace is longer than a second trace and modifying the second trace so that the length is substantially equal to the length of the first trace. In some implementations, the second trace can be modified by replacing one or more sections of the trace with two line segments that are substantially equal in length and meet at a vertex that is less than 180 degrees.

Triangular routing for high speed differential pair length matching

A rack mounting kit is configured to allow mounting of a telecommunications equipment chassis into a rack by a single person. The rack mounting kit includes two complimentary brackets that form a shelf-like feature. The complimentary brackets also include a mating latch for interfacing with a chassis to secure the chassis in place. Additionally, a cross brace is provided that is removably installed onto the two complimentary brackets to provide additionally rigidity to a rack while a chassis is being installed. The cross brace can be removed once installation of the chassis is complete.

Rack mounting kit for telecommunications equipment and rack cross brace

Embodiments relate generally to network system and apparatus for heat management of high volume network devices. More specifically, disclosed are system and apparatus that provide for improving heat dissipation of the network devices through improved air circulations, including a PCB with at least one slot and a connector cage mounted on the printed circuit board, the connector cage being within a certain distance from the at least one slot in the PCB.

System and apparatus for network device heat management

The subject technology provides configurations for a printed circuit board that includes a first reference plane, a first signal layer below the first reference plane, a second signal layer below the first signal layer, a second reference plane below the second signal layer, a first differential pair on the first signal layer, and a second differential pair on the second signal layer, each of the first and second differential pairs comprising, respectively, a first pair and a second pair of conductive traces formed on a dielectric material of the PCB, the first pair of conductive traces being arranged on the dielectric material to interleave with the second pair of conductive traces.

Differential signal crosstalk minimization for dual stripline

A Multi-Chip Module is presented herein that comprises a package substrate, at least two integrated circuit devices, each of which is electrically coupled to the package substrate, and an interposer. Formed in the interposer are electrical connections which are predominantly horizontal interconnects. The first interposer is arranged to electrically couple the two integrated circuit devices to each other. Methods for manufacturing a Multi-Chip Module are also presented herein.

Multi-chip module with multiple interposers

A single-motion trigger line card insertion/removal tool uses a handle and a spring-loaded sliding trigger to allow a technician to grab the line card insertion/removal tool with their thumb and pointer fingers, and pull the trigger while rotating the handle to eject the line card from a network device. The motion of pulling the trigger simultaneously unlocks the line card insertion/removal tool, starts the rotation of the handle with the spring load, and closes a 'window' on an optical switch breaking a continuous beam of light that software interprets as a warning that the line card will be removed momentarily. When the line card insertion/removal tool handle is rotated back to a closed position (i.e. while inserting the card), the spring tension pulls the trigger back to its original position, locking the line card insertion/removal tool handle, and opening the window for to the beam of light in the optical switch.

Growing community of inventors

Saratoga, CA, United States of America

Lin Shen