Cabot Microelectronics Corporation

Dow Global Technolgoies LLC

Saint-gobain Ceramics & Plastics, Inc.

Cmc Materials, Inc.

Rohm & Haas Electronic Materials LLC

Lin Fu

Steven Grumbine

Manish K Mundra

Timothy James Person

Jeffrey Morris Cogen

Bharat Indu Chaudhary

Mohamed Esseghir

Jeffrey Dysard

William J Ward

Glenn Whitener

Paul J Caronia

Douglas Edwin Ward

Jason Alexander Sherlock

Susan Song

Chen-Chih Tsai

Caroline H Laufer

Long Huy Bui

Chester J Kmiec

Robert F Eaton

Kevin P Dockery

Hamed Lakrout

Abhijit Ghosh-Dastidar

Matthew T Bishop

Anny L Flory

Tina C Li

Thomas S Lin

Helin Huang

Brian W Walther

William J Harris

Bruce Bell

Yabin Sun

Geoffrey David Brown

Matthias Stender

Martin William Bayes

Ping Huang

Li Fan

Xiangyang Tai

Damien Polanksy

Robert M Campbell

Sarah Brosnan

Yurong Cao

Xiang Yang Tai

Liqiang Fan

Wei Weng

Eric S Moyer

Bret P Neese

Jaeseok Lee

Rui Ma

Justin Stewart

Lei Liu

Alexei Leonov

Bruce M Bell

Nathan Speer

Carlos Barros

William Michael Spitzig

Kathryn Bergman

Li Qiang Fan

Anny Flory

A composition suitable for chemical mechanical polishing a substrate can comprise abrasive particles, a multi-valent metal borate, at least one oxidizer and a solvent. The composition can polish a substrate with a high material removal rate and a very smooth surface finish.

Composition and method for conducting a material removing operation

A chemical mechanical polishing (CMP) pad includes a polishing portion formed using a vat-based additive manufacturing process. The polishing portion includes a polymer material with a first elastic modulus. In some embodiments the polishing portion is disposed on the backing portion. The backing portion may have a second elastic modulus. The second elastic modulus may be less than the first elastic modulus.

Chemical mechanical planarization pads via vat-based production

A chemical-mechanical polishing pad comprising a thermosetting polyurethane polishing layer includes an isocyanate-terminated urethane prepolymer, a polyamine curative, and a cyclohexanedimethanol curative. The polyamine curative and the cyclohexanedimethanol curative are in a molar ratio of polyamine curative to cyclohexanedimethanol curative in a range from about 20:1 to about 1:1.

Polishing pad employing polyamine and cyclohexanedimethanol curatives

A fluid composition suitable for chemical mechanical polishing a substrate can in include a multi-valent metal borate, at least one oxidizer, and a solvent. The fluid composition can be essentially free of abrasive particles and may achieve a high material removal rate and excellent surface finish.

Fluid composition and method for conducting a material removing operation

A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.

Polyurethane CMP pads having a high modulus ratio

A metallized optical fiber comprises: A) An optical fiber, and B) A conductive metal over and in contact with the optical fiber and having a thickness that is at least 0.15 times the thickness of the optical fiber. The metallized optical fiber can form a component of a hybrid optical fiber/coaxial cable, and it provides good protection against interference with the data signal traveling along the optical fiber from electrical current from an adjacent or near-by electrical conductor.

Metallized optical fiber

The present disclosure is directed to a plasticizer composition, polymeric compositions containing the plasticizer composition, and conductors coated with the polymeric composition. The plasticizer composition includes a first plasticizer comprising epoxidized fatty acid alkyl esters and a second plasticizer comprising an epoxidized natural oil. The plasticizer composition, first plasticizer, and/or second plasticizer can undergo one or more color-reducing treatment processes, such as distillation, filtration, and/or peroxide treatment.

Plasticizer compositions and methods for making plasticizer compositions

Polymeric compositions suitable for use as insulation materials in electrical applications. Such polymeric compositions comprise an ethylene/&#x3b1;-olefin-based elastomer and a filler, where the filler consists essentially of an amorphous silica. Such polymeric compositions can optionally further comprise an ethylene-based thermoplastic polymer. Also disclosed are coated conductors comprising such polymeric compositions as insulation materials.

Elastomer-based polymeric compositions having amorphous silica fillers

Conductive cores for use in cables, where the conductive core comprises a filled-polymeric-composite material concentrically surrounded by a conductive layer. The filled-polymeric-composite material comprises a polymeric continuous phase having dispersed therein a filler material. Such conductive cores can be employed in various cable designs and further include one or more outer layers, such as dielectric insulation layers, conductive shield layers, and jackets.

Cable with polymer composite core

Described are chemical-mechanical polishing compositions (e.g., slurries) and methods of using the slurries for chemical-mechanical polishing (or planarizing) a surface of a substrate that contains tungsten, the compositions containing cationic surfactant and cyclodextrin.

Tungsten-processing slurry with cationic surfactant and cyclodextrin

A composition comprising (A) at least one bisphenol-A polycarbonate resin, (B) at least one polypropylene, preferably a high crystallinity polypropylene, (C) at least one compatibilizer comprising an amine functionalized elastomeric polymer, (D) at least one organic phosphate flame retardant, preferably an organic phosphate that is liquid at room temperature, and, optionally, (E) one or more additives. These compositions are useful in the manufacture of wire insulation coatings of less than 0.2 mm with good scrape abrasion resistance.

Flame retardant thermoplastic composition of polycarbonate and polypropylene

Described are chemical mechanical polishing compositions and methods of using the compositions for planarizing a surface of a substrate that contains tungsten, the compositions containing silica abrasive particles and cationic surfactant.

Tungsten-processing slurry with cationic surfactant

A chemical mechanical polishing composition for polishing a substrate having a tungsten layer includes a water based liquid carrier, a colloidal silica abrasive dispersed in the liquid carrier and having a permanent positive charge of at least 6 mV, an amine compound in solution in the liquid carrier, and an iron containing accelerator. A method for chemical mechanical polishing a substrate including a tungsten layer includes contacting the substrate with the above described polishing composition, moving the polishing composition relative to the substrate, and abrading the substrate to remove a portion of the tungsten from the substrate and thereby polish the substrate.

Composition for tungsten CMP

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Naperville, IL, United States of America

Lin Fu