Taiwan Semiconductor Manufacturing Comp. Ltd.

Lin Chung-Yi

Chen-Shien Chen

Hsi-Kuei Cheng

Kuo-Chio Liu

Yi-Jen Lai

A method includes forming a release film over a carrier, forming a polymer buffer layer over the release film, forming a metal post on the polymer buffer layer, encapsulating the metal post in an encapsulating material, performing a planarization on the encapsulating material to expose the metal post, forming a redistribution structure over the encapsulating material and the metal post, and decomposing a first portion of the release film. A second portion of the release film remains after the decomposing. An opening is formed in the polymer buffer layer to expose the metal post.

Growing community of inventors

Hsinchu, Taiwan

Lin Chung-Yi