Corning Incorporated

Lili Tian

Prantik Mazumder

Valerio Pruneri

Paul Arthur Sachenik

David Eugene Baker

David Francis Dawson-Elli

Lynn Bernard Simpson

Carme Gomez Carbonell

Natesan Venkataraman

Robert Alan Bellman

Sean Matthew Garner

Yawei Sun

Mallanagouda D Patil

James Gregory Couillard

Jiangwei Feng

Glen Bennett Cook

Christopher Paul Daigler

Sue Camille Lewis

Ian David Tracy

Albert Carrilero

Tomohiro Ishikawa

Jeremy Curtis Clark

Ashish Hersh Chaturvedi

Johann Osmond

Richard Jonathon Kohler

Mallanagouda Dyamanagouda Patil

Described herein are improved dewetting methods and improved patterned articles produced using such methods. The improved methods and articles generally implement continuous ultra-thin metal-containing films or film stacks as the materials to be dewetted. For example, a method can involve the steps of providing a substrate that has a continuous ultra-thin metal-containing film or film stack disposed on a surface thereof, and dewetting at least a portion of the continuous ultra-thin metal-containing film or film stack to produce a plurality of discrete metal-containing dewetted islands on the surface of the substrate.

Metal dewetting methods and articles produced thereby

Disclosed are AZO films deposited on a transparent substrate by pulse DC using an oxide target with a composition in the range 0.5-2 wt % AlO, desirably at temperature above 325&#xb0; C., resulting in films showing columnar grain structure with columns extending from the top to the bottom of the film, and small lateral grain size (less than 70 nm from substrate to top of film). The film has low resistivity at less than 10 Ohm/square at a thickness less than 400 nm, resistivity is desirably unchanged by annealing at temperatures of up to 450&#xb0; C.

Sputtered transparent conductive aluminum doped zinc oxide films

A method of forming an optical structure in a continuous manufacturing process includes providing a continuous ribbon of flexible glass substrate () having a thickness of no more than 0.3 mm. The continuous ribbon of flexible glass substrate has a first side and a second side separated by a plane formed by the ribbon of flexible glass substrate. A liquid polarizer material () is applied on the ribbon of flexible glass substrate at one of the first and second sides as the continuous ribbon of flexible glass substrate moves by a polarizer material application apparatus to form a polarizing layer. A conductive material () is applied on the ribbon of flexible glass substrate at one of the first and second sides to form a touch layer for a touch sensitive display.

Optical structures having integrated component layers

Glass web including a first glass-web portion (), a second portion (), and a splice joint () coupling the first glass-web portion to the second portion, wherein the slice joint includes a splice member () with at least one gas-permeable attachment portion. In further examples, methods of splicing a first glass-web portion to a second portion include the step of splicing the first glass-web portion to the second portion with a splice member, wherein the step of splicing includes attaching a gas-permeable attachment portion of the splice member to the first glass-web portion.

Glass webs and methods of splicing

Described herein are various methods for making textured articles, textured articles that have improved fingerprint resistance, and methods of using the textured articles. The methods generally make use of masks comprising nanostructured metal-containing features to produce textured surfaces that also comprise nanostructured features. These nanostructured features in the textured surfaces can render the surfaces hydrophobic and oleophobic, thereby beneficially providing the articles with improved fingerprint resistance relative to similar or identical articles that lack the texturing.

Textured surfaces and methods of making and using same

Methods and apparatus provide for a structure, including: a first glass material layer; and a second material layer bonded to the first glass material layer via bonding material, where the bonding material is formed from one of glass frit material, ceramic frit material, glass ceramic frit material, and metal paste, which has been melted and cured.

Methods for bonding material layers to one another and resultant apparatus

A method of treating a sheet of semiconducting material comprises forming a sinterable first layer over each major surface of a sheet of semiconducting material, forming a second layer over each of the first layers to form a particle-coated semiconductor sheet, placing the particle-coated sheet between end members, heating the particle-coated sheet to a temperature effective to at least partially sinter the first layer and at least partially melt the semiconducting material, and cooling the particle-coated sheet to solidify the semiconducting material and form a treated sheet of semiconducting material.

Technique to modify the microstructure of semiconducting materials

Growing community of inventors

Laurel, MD, United States of America

Lili Tian