Shanghai Micro Electronics Equipment (Group) Co., Ltd.

Lili Ge

Yuebin Zhu

Fei Ni

Xu Zhou

Haicang Cui

A motion stage device, an exposure device and a lithography machine are disclosed. The motion stage device includes: Y-direction motors (), a mover of each Y-direction motor () movable in a horizontal Y-direction; X-direction motors provided on X-direction guide rails (), the X-direction guide rails () is in connection with the movers of the Y-direction motors () and movable in the horizontal Y-direction under actuation of the Y-direction motors (), the X-direction motors having movers () movable in a horizontal X-direction; an inner frame (), supporting the X-direction guide rails (); and a motion stage (), disposed on the movers () of the X-direction motor. This motion stage device possesses improved modal and vibration characteristics because of a reduced load on the Y-direction motors (). Additionally, the X-direction guide rails () are in non-contact connection with the inner frame () and thus will not pose significant vibration-causing impacts on the inner frame (). This allows stable movement and improved control accuracy.

Moving platform device, exposure device and lithography machine

A silicon wafer edge protection device having: a horizontal motion assembly; vertical motion assembly; speed regulating device, which is in signal connection with the vertical motion assembly and used for regulating vertical motion assembly motion speed; flexible bumper assembly, which is connected to the horizontal motion assembly and vertical motion assembly and used for reducing the amplitude of vibration of the silicon wafer edge protection device when a collision occurs; and control device, which is in signal connection with the speed regulating device and used for sending a control signal to the speed regulating device to control motion of the vertical motion assembly. The silicon wafer edge protection device can prevent a wafer stage from undergoing an instantaneous strong impact and prevent a silicon wafer from being crushed. When a collision occurs, the wafer stage and the silicon wafer can be protected. Production efficiency is also improved.

Growing community of inventors

Shanghai, China

Lili Ge