Intel Corporation

Lijiang Wang

Sujit Sharan

Robert L Sankman

Jianyong Xie

Arghya Sain

Kemal Aygun

Sanka Ganesan

Sri Chaitra Jyotsna Chavali

Xiaohong Jiang

Cemil S Geyik

Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a first trace embedded in a package substrate. In an embodiment, the first trace comprises a first region, where the first region has a first width, and a second region, where the second region has a second width that is smaller than the first width.

Package design scheme for enabling high-speed low-loss signaling and mitigation of manufacturing risk and cost

Embodiments disclosed herein include electronic packages. In an embodiment, an electronic package comprises a package substrate, wherein the package substrate comprises a first routing architecture. In an embodiment, the electronic package further comprises a first die on the package substrate, a second die on the package substrate, wherein the first die is electrically coupled to the second die by a bridge embedded in the package substrate, and a routing patch on the package substrate. In an embodiment, the routing patch is electrically coupled to the second die, and wherein the routing patch comprises a second routing architecture that is different than the first routing architecture.

Scalable high speed high bandwidth IO signaling package architecture and method of making

An electronic device and associated methods are disclosed. In one example, the electronic device includes an article having a substrate, a semiconductor die thereon, a routing carrier attached to the substrate, and a transmission pathway electrically connected to the semiconductor die and the substrate, wherein the transmission pathway runs through the routing carrier. In selected examples, the article is made by manufacturing a substrate, attaching a semiconductor die to the substrate, fabricating a routing carrier comprising a transmission pathway, and integrating the routing carrier into the substrate.

Signal routing carrier

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Chandler, AZ, United States of America

Lijiang Wang