Motorola Corporation

Freescale Semiconductor,inc.

Motorla, Inc.

Lih-Tyng Hwang

Robert B Lempkowski

Li Li

William H Lytle

Jovica Savic

Treliant Fang

Aroon V Tungare

James E Drye

William M Williams

Manes Eliacin

Shun Meen Kuo

Junhua Liu

A micro-electro-mechanical system varactor. The varactor includes a substrate, a lower bias conductor partially overlaying the substrate, a first signal conductor partially overlaying the substrate, a dielectric layer at least partially overlaying the first signal conductor, a support structure coupled to the substrate, and a flexible structure coupled to the support structure. The flexible structure is suspended over the substrate, includes an upper bias conductor overlaying at least part of the lower bias conductor and a top conductor overlaying at least part of the first signal conductor, configured to deflect in response to a bias voltage applied between the upper bias conductor and the lower bias conductor, and configured for separation between the top conductor and the dielectric layer by a varying separation distance dependent upon the bias voltage.

Micro-electro-mechanical system varactor

A first and second capacitor plate are provided (and). Each capacitor plate has an opening disposed therethrough with the second capacitor plate being disposed substantially opposite the first capacitor plate. A first electrically conductive path interface is then disposed () in one of these openings as is at least a second electrically conductive path interface ().

Apparatus and methods relating to electrically conductive path interfaces disposed within capacitor plate openings

An embedded multilayer printed circuit includes a first ground plane () of a multilayer printed circuit board and an embedded layer. The embedded layer includes a co-planar capacitor (), a distributed inductor (), and a capacitive plate () circuit. The capacitive plate is a plate of a vertical capacitor (). The embedded layer further includes a node () of the embedded multilayer printed circuit that is formed by a connection of a first terminal of the co-planar capacitor and a first terminal of the first distributed inductor, and in some embodiments, the first capacitive plate is also connected to the node. A second terminal of one of the co-planar capacitor and the distributed inductor is connected to the first ground plane.

Embedded multilayer printed circuit

A semiconductor device for multiple dice is provided that reduces insertion loss and return loss. In an example embodiment, the semiconductor device comprises: a packagecomprising a mount surfaceto which diceandare mounted, and a bond pad surfacedefining at least a first die areaand a second die areawherein the second die areais different in form from the first die area

Multiple dice package

An embodiment of a current-carrying structure () includes a first electrically conductive layer () and a second electrically conductive layer (). The second electrically conductive layer is in contact with the first electrically conductive layer along substantially the entire length of the first electrically conductive layer. The second electrically conductive layer is above the first electrically conductive layer. A non-electrically conductive layer () is in contact with the first electrically conductive layer and the second electrically conductive layer. A current travels simultaneously through the first electrically conductive layer and the second electrically conductive layer.

Current-carrying electronic component and method of manufacturing same

A bonding structure (10) is formed between a first component (12) and a second component (11) to form a semiconductor device. The bonding structure (10) comprises a bump (24) that has a pedestal region (22) and a crown region (23). The crown region (23) is anchored into a well region (13) of a conductive material (16) that is formed on the second component (11).

Bonding structure for an electronic device

A process for using removable Z-axis anisotropically conductive adhesive material (21) which includes water, a matrix resin (23), and conductive spheres (22). The material (21) is suitable for providing temporary contact between electronic devices. In one embodiment, the material (21) is used to temporarily bond a semiconductor wafer (11) to a probe substrate (12) for wafer-level burn-in.

Growing community of inventors

Crystal Lake, IL, United States of America

Lih-Tyng Hwang