Henkel Ag & Company, Kgaa

Other

Liesbeth Theunissen

Gunther Dreezen

Anja Henckens

Jing Yang

Chao B Zhang

Qili Wu

Rudolf Oldenzijl

Marc Estruga Ortiga

Bart Van Remoortere

Cindy Van Der Borght

The present invention relates to an electrically conductive composition comprising a) a resin selected from the group consisting of epoxy (meth)acrylate, (poly)ester (meth)acrylate, urethane (meth)acrylate, silicone (meth)acrylate, poly(iso)butylene (meth)acrylate, (poly)isoprene (meth)acrylate, polybutylene (meth)acrylate and mixtures thereof; b) an acrylic monomer; c) an electrically conductive filler; and d) a curing agent. The composition is particularly suitable for use in a solar cell and/or a photovoltaic module, especially in the photovoltaic module, wherein the solar cells are shingled.

Electrically conductive adhesive for attaching solar cells

The present invention relates to a conductive paste composition for solar photovoltaic cells comprising metal particles dispersed in a suitable carrier therefor, wherein said carrier comprises a solvent and a resin, and wherein at least a portion of said metal particles are characterized by having a &#x3c8; value, as defined by X-ray diffraction&#x3c;0.0020, having at least 50% degree of crystallinity, and being anisotropic with respect to crystallographic direction.

Sinterable composition for use in solar photovoltaic cells

The present invention relates to thermally curable adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The thermally curable adhesives comprise at least one thermosetting resin, electrically conductive particles having an average particle size of 1 &#x3bc;m to 50 &#x3bc;m, and at least one metal precursor, wherein the metal precursor decomposes substantially to the corresponding metal during the thermal curing of the thermally curable adhesive.

Electrically conductive adhesives comprising at least one metal precursor

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesive of the present invention comprises one or more epoxy resins, silver-coated particles having a silver content of 2 to 30 wt.- %, based on the total amount of the silver-coated particles, and one or more amine-epoxy adducts, comprising one or more functional groups, each derived from an alkyl-substituted nitrogen-containing heterocycle.

Electrically conductive adhesives comprising silver-coated particles

The present invention relates to adhesives that are suitable for use as electrically conductive materials in the fabrication of electronic devices, integrated circuits, semiconductor devices, passive components, solar cells, solar modules, and/or light emitting diodes. The adhesives comprise at least one resin component, micron-sized electrically conductive particles having an average particle size of 2 &#x3bc;m to 50 &#x3bc;m, and from 0.01 to 15 wt. % of sub-micron-sized electrically conductive particles having a average particle size of 300 nm to 900 nm.

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Wilsele, Belgium

Liesbeth Theunissen