Micron Technology Incorporated

Lien Wah Choong

Kean Tat Koh

Kian Chai Lee

Vijendran M

Teoh Bee Yong Tim

Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.

Semiconductor mold compound transfer system and associated methods

Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.

A method and apparatus for distributing a mold material in a mold for packaging microelectronic devices. In one embodiment, the microelectronic devices are placed on a substrate and the substrate is at least partially enclosed by the device region of a mold cavity. A mold material is passed along a flow axis through at least one entrance port into an intermediate region of the mold. The mold material is then passed from the intermediate region into the device region through a single opening spaced apart from and positioned between the entrance port and the microelectronic device. The single opening has a flow area transverse to the flow axis smaller than a flow area immediately upstream of the single opening to restrict the flow through the single opening. The mold material can accordingly form a uniform leading edge as it exits the opening and before it impinges on the microelectronic device.

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Singapore, Singapore

Lien Wah Choong