Western Digital Technologies, Inc.

Hgst Netherlands, B.v.

Hitachi Global Storage Technologies Netherlands B.v.

Fujitsu Corporation

Meta Platforms Technologies, LLC

Apple Inc.

Sandisk Technologies Inc.

Lidu Huang

Fu-Ying Huang

Toshiki Hirano

Erhard Theodor Schreck

Barry C Stipe

John Thomas Contreras

Kishio Yokouchi

Jeffrey David Wilke

Scott Edward Watson

Shen Ren

Alexei L Glebov

David K Myers

Nils E Larson

Takuya Matsumoto

Petrus Antonius Van Der Heijden

Tetsuo Semba

Darya Amin-Shahidi

Rehan Ahmed Zakai

Shigenori Aoki

Jin Hui Ou-Yang

Samir Y Garzon

John Robert Edwards

Yizhi Xiong

Thomas R Albrecht

Bruce Alvin Gurney

Luiz M Franca-Neto

Cyril Guyot

Michael G Lee

Bruno Jean Marchon

Michael Grobis

Guy Charles Wicker

Qing Dai

Olav Hellwig

Federico Nardi

Chie Ching Poon

Hamid Balamane

Mac D Apodaca

Xing-Cai Guo

Fei Liu

Hans Juergen Richter

Chiao-Ping (Roger) Ku

Chen-Chi Lin

Hitoshi Shindo

Gurinder P Singh

Aaron D Little

Nagarajan Kalyanasundaram

Colleen F Mischke

Xinjiang Shen

David William Niss

Andrew Keith Hanlon

Jia-Yang Juang

Michael Stephen Bell

Sripathi Vangipuram Canchi

Joshua P Weiher

Ailian Zhao

Vijay P S Rawat

Simone Pisana

Victor W Santini

Anuranjini Pragada

Honghong Peng

Antony Nguyen

Peng Chen

Kenneth Allen

Shaomin Xiong

Jeff Wilke

Seungman Chang

Joselito S Jose

Jianren Lin

Todd McNally

Peter G Robinson

Chiaoping Ku

Andrew Thomas McCallum

Thomas Hauet

Charles Leverne Taylor, Jr

Stephen Leonard Schmidt

Qing Zhang

Hamid Salehizadeh

Lawrence Matthew Roberts

William Wei Yi Yu

Perry E Hall

Lawrence H Lo

Dongmin Yang

Michael Andrew Brookmire

Byron Lengsfield

Zhaochun Yu

Gwo-Jeng Lo

Alaa Al-okaily

Derek J Iredale

Michael R Monson

Pierre P Souloumiac

Zakir A Quabili

One embodiment of the present invention sets forth a technique for intelligently accessing one or more different hardware-based mechanisms for cropping out, blurring or blocking private content in a live preview image generated for the camera and in media recorded by the camera. The technique incudes receiving input regarding a plurality of objects to be concealed in media captured by an imaging device and identifying at least one of the plurality of objects in a field of view of the imaging device. Further, the technique includes modifying the at least one of the plurality of objects in a live preview image or media captured by the imaging device using one or more hardware-based actuators, where the modifying the at least one of the plurality of objects causes the one of the plurality of objects to be concealed.

Hardware-based protection of private content captured by a camera device

A stabilization actuation assembly includes a lens barrel, a magnetic assembly, one or more stabilizing coils, an outer shell, and a piece of ferromagnetic material. The lens barrel is configured to carry a lens that is positioned along an optical axis. The magnetic assembly includes a plurality of magnets that produce a magnetic field. The one or more stabilizing coils are coupled to a printed circuit board below the plurality of magnets. The outer shell includes an aperture through which the lens barrel can actuate. The piece of ferromagnetic material is coupled to a surface of the outer shell and is positioned to augment the magnetic field. A current supplied to the one or more stabilizing coils interacts with the augmented magnetic field to cause the magnetic assembly together with the lens barrel to translate in a direction perpendicular to the optical axis.

Augmented optical image stabilization using ferromagnetic materials

An electronic module includes an operational subunit, having upper, lower and lateral surfaces, and including one or more electronic components, which are adjacent to the lower surface of the operational subunit and generate heat when the module is in operation. A heat sink is disposed in proximity to the lower surface of the operational subunit. A heat spreader, including a continuous sheet of a heat-conducting material, is folded to wrap around the operational subunit so that a lower side of the sheet is interposed between the lower surface of the operational subunit and the heat sink and a lateral side of the sheet extends around at least one of the lateral surfaces of the operational subunit.

Efficient heat removal from electronic modules

Embodiments disclosed herein generally relate to a method for monitoring optical power in a HAMR device. In one embodiment, the method includes enhancing a thermal sensor bandwidth through advanced electrical detection techniques. The advanced electrical detection techniques include obtaining calibration waveform data for a thermal sensor by calibrating the thermal sensor, obtaining real-time waveform data for the thermal sensor that may deviate from the calibration waveform data, updating the calibration waveform data to include the real-time waveform data, repeating obtaining real-time waveform data and updating the calibration waveform data during writing operations. By updating the calibration waveform data, the bandwidth of the thermal sensor is determined by a fixed sampling time interval, and the thermal sensor rise time to steady state would not be a limitation to its response time.

HAMR thermal sensor with fast response time

Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, an apparatus is provided comprising a backplane that comprises a substrate comprising an at least partially flexible material and a connector island assembly formed in the substrate. The connector island assembly comprises a spring element and a connector island. The spring element extends from a main portion of the substrate, and the connector island extends from the spring element. The connector island assembly is surrounded by the main portion of the substrate and configured to flex independently of the main portion of the substrate.

Alternately shaped backplane for receiving electrical components

Provided herein are systems and apparatus for reducing vibration interaction between hard drives. In one implementation, a flexible mount electrical connection comprises a mating connector configured to physically couple with a hard drive connector and a plurality of electrical pins having a connector portion positioned within the mating connector configured to electrically couple with hard drive connector pins positioned within the hard drive connector. Each electrical pin has an extended portion extending away from the mating connector. The extended portion has an attachment portion configured to electrically couple the respective electrical pin to a printed circuit board, and the extended portion has a shape formed therein configured to reduce transmission of vibrations in the connector portion along each axis of a three-dimensional space to the attachment portion.

Flexible-mount electrical connection

Systems and methods for providing a phase change memory that includes a phase change material, such as a chalcogenide material, in series with a heating element that comprises multiple thermal interfaces are described. The multiple thermal interfaces may cause the heating element to have a reduced bulk thermal conductivity or a lower heat transfer rate across the heating element without a corresponding reduction in electrical conductivity. The phase change material may comprise a germanium-antimony-tellurium compound or a chalcogenide glass. The heating element may include a plurality of conducting layers with different thermal conductivities. In some cases, the heating element may include two or more conducting layers in which the conducting layers comprise the same electrically conductive material or compound but are deposited or formed using different temperatures, carrier gas pressures, flow rates, and/or film thicknesses to create thermal interfaces between the two or more conducting layers.

Phase change memory electrode with multiple thermal interfaces

A data storage system assembly includes a rigid central plate with multiple data storage devices (DSDs) mounted on the central plate, where a first row of DSDs is coupled with a first side of the central plate, and a second row of DSDs is coupled with a second side of the central plate, both in a side-by-side arrangement. A plurality of flexible mounting grommets may be fastened to each DSD and coupled to the central plate, such as in an arrangement in which an even number of grommets are fastened to one side and an odd number of grommets are fastened to an opposing side of the DSD. Each respective DSD may be fastened to a corresponding adaptor plate, where each adaptor plate is coupled with the central plate. Flexible mounting grommets may be fastened to each adaptor plate and coupled to the central plate.

Data storage system enclosure with central mounting plate

A decoupled partitioning divider for a data storage system enclosure includes a first leg having proximal and distal halves and a second leg having proximal and distal halves, and in which the first and second legs are coupled together at either the proximal or distal half and uncoupled from each other at the other of the proximal and distal halves, so that the divider legs are decoupled from each other at one half or one end. When installed in a data storage system enclosure between adjacent data storage devices, such as hard disk drives, vibration transfer among the devices housed therein may be inhibited.

Data storage system enclosure with decoupled divider

A backplane configured to receive electrical components is provided. The backplane in one example includes a substrate comprising an at least partially flexible material, a plurality of backplane traces formed as part of the substrate, at least one connector island formed in the substrate, with the at least one connector island located in an opening in the substrate and configured to receive at least one mating electrical component, and one or more spring elements bridging between the at least one connector island and the substrate, with traces of the plurality of backplane traces extending over the one or more spring elements to the at least one connector island and with the one or more spring elements allowing the at least one connector island to flex with respect to the substrate and absorb vibrations.

Backplane for receiving electrical components

A backplane configured to receive electrical components is provided. The backplane in one example includes a substantially planar substrate comprising an at least partially flexible material and formed in a non-rectangular shape, a series of alternating connector islands formed along two substantially parallel axes, wherein each connector island is able to move independently of other connector islands, a plurality of backplane traces extending from the series of alternating connector islands to a backplane connector region of the substrate, with a number of backplane traces increasing closer to the backplane connector region, and one or more spring elements bridging between a particular connector island and the substrate, with the one or more spring elements allowing the particular connector island to flex with respect to the substrate and absorb vibrations.

Shaped backplane for receiving electrical components

Embodiments described herein generally relate to controlling the flying height of a slider. The methods can include transmitting radiation from a radiation source, determining a change in temperature, the change in temperature being the difference between a first temperature and an ambient temperature and changing the flying height of the slider and head based on the change in temperature. The devices generally include a head with a supporting surface and a media facing surface, a radiation source submount, a radiation source, and a temperature sensor positioned proximate the radiation source submount or the radiation source.

Compensation of laser diode introduced flying height changes

In one embodiment, a system includes a magnetic head having a write portion having a main pole, a near field transducer comprising a conductive metal film having outer regions extending from an active region, and an optical waveguide for illumination of the near field transducer, wherein the conductive metal film extends in a cross track direction for a width at least 200% greater than a width of the active region of the conductive metal film, wherein a portion of the main pole extends along the conductive metal film in a cross track direction for a width at least 200% greater than the width of the active region of the conductive metal film.

Heat assisted magnetic recording head having wider heat sink and pole

In one general embodiment, an apparatus includes a write pole, a near field transducer, a waveguide for delivering light to the near field transducer, and a first heating device positioned between the write pole and at least one of the waveguide and the near field transducer.

Combined micro heater and waveguide power sensor for heat-assisted magnetic recording

Growing community of inventors

Danville, CA, United States of America

Lidu Huang