Shenzhen Envicool Technology Co., Ltd

Lichuan Wei

Xi Yang

Zhao Lu

Zhiqiang Cai

Kailun Zhang

Weiyang Lai

Ye Wang

Viacheslav Stetsyuk

John C Chai

A cooling device includes a cooling plate and a buffer portion, a flow passage is formed in the cooling plate, and the buffer portion is arranged on the cooling plate. An inlet buffer zone and an outlet buffer portion are defined in the buffer portion, liquid flows into the flow passage through the inlet buffer zone and flows out of the flow passage through the outlet buffer portion. The liquid flows into the flow passage through the buffer portion, and the buffer portion can reduce the flow resistance of the liquid flowing into the flow passage. The liquid in the flow passage also flows out through the buffer portion, and the buffer portion can also reduce the flow resistance of the liquid flowing out of the flow passage.

Cooling device and electronic device

A liquid cooled plate and an electronic computing device are provided. The liquid cooled plate includes multiple channels communicated in sequence, and adjacent channels are communicated via a communicating portion. Multiple partitions divide each of the channels to multiple flow passages, and a part of each of the partitions extends into the communicating portion, and lengths of the multiple partitions extending into the communicating portion gradually increases or decreases according to a preset rule. With this arrangement, the coolant can be collected and redistributed before entering the next channel, which is more conducive to the uniform distribution of the coolant, thereby improving the overall heat exchange capacity of the liquid cooled plate, and thus can better meet the actual usage requirements.

Liquid cooled plate and electronic computing device

A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.

Hybrid heat sink

Growing community of inventors

Guangdong, China

Lichuan Wei