Kulicke and Soffa Industries, Inc.

Sv Probe Pte. Ltd.

Lich Thanh Tran

Reynaldo M Rincon

Edward T Laurent

Son N Dang

Edward Lambert Malantonio

Gerald Back

Dan Mironescu

Ilan Hanoon

A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (), the foot defining a substantially flat surface configured to be connected to a substrate (), a second end portion terminating in a tip (), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion () extending between the first end portion and the second end portion.

Probes for a wafer test apparatus

A method and apparatus for a flattened probe element wire is provided. A probe element wire includes a beam portion and a tip portion. At least a part of the tip portion is flattened. Flattened probe element wires may have greater z-direction height strength, thereby increasing maximum probe element wire z-direction vertical force. Flattened probe element wires may also have decreased variability in the flattened probe element wire tips. A probe card assembly may includes a substrate and a plurality of at least partially flattened probe element wires supported by the substrate. Such probe card assemblies may have an extended life and maintained within design parameters for a longer period of use.

Cantilever probe card

Growing community of inventors

San Jose, CA, United States of America

Lich Thanh Tran