Applied Materials, Inc.

Liang-Yun Chen

Manoocher Birang

Stan D Tsai

Yan Wang

Paul D Butterfield

Alain Duboust

Rashid Mavliev

Lakshmanan Karuppiah

Yuchun Wang

Ralph M Wadensweiler

You Wang

Daniel A Carl

Jie Diao

Renhe Jia

Robert A Ewald

An article of manufacture and apparatus are provided for processing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive polishing surface. An electrode is disposed below the polishing surface having a dielectric material therebetween. A plurality of apertures may be formed in the polishing surface and the dielectric material to at least partially expose the electrode to the polishing surface. A membrane may be disposed between the electrode and the polishing surface that is permeable to ions and current to promote continuity between the electrode and the polishing surface.

Conductive pad with ion exchange membrane for electrochemical mechanical polishing

Growing community of inventors

Foster City, CA, United States of America

Liang-Yun Chen