General Electric Company

Ge Aviation Systems Limited

Liang Yin

David Richard Esler

Emad Andarawis Andarawis

Christopher James Kapusta

Brian Magann Rush

David Mulford Shaddock

Reza Ghandi

Cheng-Po Chen

Richard Anthony Eddins

Liqiang Yang

Judd Everett Swanson

Arun Virupaksha Gowda

The disclosure relates to an apparatus for connecting an electronic component to a conductor. A housing includes at least one slot and defines at least one component chamber for carrying the electronic component. A liquid coolant can pass through the housing. A pair of conductive members extends from the housing through the at least one slot and can be releasably inserted into a channel defined in a support assembly. The support assembly facilitates an electrical connection between the conductive members and corresponding conductive contact members connected to a respective power supply or electrical load. The support assembly can provide an inward sealing force to a seal on the housing circumscribing the pair of conductive members.

Electronic connection assembly

An electrical component and method for manufacturing the electrical component with a substrate a conductor stack having multiple layers and including at least one electrically conductive path. The conductor stack mounted to the substrate with a dielectric passivation stack encasing at least a portion of the conductor stack.

Electrical component with a dielectric passivation stack

The disclosure relates to an apparatus and method for liquid cooling of an electronic component. A housing includes an insertion slot and defines at least one component chamber for carrying the electronic component. A fluid inlet and fluid outlet are provided on the housing. A liquid coolant circuit passes through the housing at least from the inlet to the outlet.

Liquid-cooled assembly and method

Growing community of inventors

Clifton Park, NY, United States of America

Liang Yin