Taiwan Semiconductor Manufacturing Comp. Ltd.

Tsinghua University

Liang-Wei Wang

Dian-Hau Chen

Hsiang-Ku Shen

Yen-Ming Chen

Chen-Chiu Huang

Chih-Fan Huang

Chih-Pin Chiu

Tsung-Chieh Hsiao

Yu-Jen Wang

Ku-Feng Lin

Chih-Chuan Su

Wei-Chih Wen

Chih-Huang Lai

Yu-Feng Yin

Hung-Chao Kao

Po-Sheng Lu

Wen-Chiung Tu

Yun-Chung Wu

Chih Hsin Yang

Tzu-Ting Liu

Zhen De Ma

Lee-Wen Hsu

Wen-Chieh Shih

Disclosed semiconductor device manufacturing processes improve the flatness of a passivation layer deposited above a redistribution layer (RDL). When a thin passivation layer is deposited above the RDL, its top surface tends to become very uneven due to the large gaps that typically form over the etched portions of the RDL, particularly when the RDL is disposed over an underlying super high density metal-insulator-metal (MIM) capacitor. In order to reduce the incidence of stress concentration areas on the uneven surface, a thicker passivation layer is instead deposited to minimize gap formation therein, and a chemical mechanical planarization (CMP) process is then performed to further smooth the top surface thereof. Reduction of the stress in this manner reduces the incidence of cracking of the underlying MIM, which improves the overall pass rates of semiconductor devices so manufactured.

Semiconductor structures and methods for manufacturing the same

A method for forming a semiconductor structure includes forming a metal-insulator-metal (MIM) structure between first passivation layers over a substrate. The method also includes forming a via structure through the MIM structure and the first passivation layers. The method also includes planarizing the via structure. The method also includes forming an RDL structure over the via structure. The method also includes forming a second passivation layer over the RDL structure and the first passivation layers.

Semiconductor structure and method for forming the semiconductor structure

A semiconductor package includes a first integrated circuit and a second integrated circuit. The first integrated circuit includes a first semiconductor substrate, a first bonding structure bonded to the second integrated circuit, a ferromagnetic layer surrounding the first bonding structure, and a memory cell between the first semiconductor substrate and the first bonding structure.

Semiconductor packages

A semiconductor structure and processes of forming the same are provided. A semiconductor structure according to the present disclosure includes a first die having a front surface and a back surface and a second die bonded to the back surface of the first die. The first die includes a plurality of trenches adjacent the back surface and the plurality of trenches are filled with a liquid.

Semiconductor package with improved heat distribution

A redistribution structure is provided. A redistribution structure according to the present disclosure includes a first dielectric layer, a mesh metal feature disposed in the first dielectric layer and including a base portion and a frame portion surrounding the base portion, a second dielectric layer disposed over the first dielectric layer and the mesh metal feature, a redistribution feature disposed over the second dielectric layer, a passivation structure disposed over the redistribution feature and the second dielectric layer, a pad opening extending through the passivation structure to expose a top surface of the redistribution feature. The redistribution feature includes a plurality of contact vias that extend through the second dielectric layer to land on the frame portion of the mesh metal feature.

Wafer test pad

A semiconductor structure includes a third metal layer immediately above a second metal layer that is over a first metal layer. The second metal layer includes magnetic tunneling junction (MTJ) devices in a memory region and a first conductive feature in a logic region. Each MTJ device includes a bottom electrode and an MTJ stack over the bottom electrode. The third metal layer includes a first via electrically connecting to the first conductive feature, and a slot via over and electrically connecting to the MTJ stack of the MTJ devices. The slot via occupies space extending continuously and laterally from a first one to a last one of the MTJ devices. The first via is as thin as or thinner than the slot via. The third metal layer further includes second and third conductive features electrically connecting to the first via and the slot via, respectively.

Structure and method for MRAM devices with a slot via

A semiconductor memory structure includes bottom electrodes formed over a substrate. The structure also includes first magnetic tunneling junction (MTJ) elements formed over the bottom electrodes in a first region and a second region of the substrate. The structure also includes second MTJ elements formed over the first MTJ elements in the first region and the second region. The structure also includes top electrodes formed over the second MTJ elements. The first MTJ elements in the first region are narrower than the second MTJ elements in the first region, and the second MTJ elements in the second region are narrower than the first MTJ elements in the second region.

Semiconductor memory structure and method for forming the semiconductor memory structure

A semiconductor device includes a substrate, a gate structure, a source region and a drain region, a conductive via and an isolation structure. The gate structure is disposed over the substrate. The source region and the drain region aside the gate structure. The conductive via is disposed in the substrate. The isolation structure is disposed in the substrate, wherein a first surface of the isolation structure is substantially flush with a first surface of the conductive via.

Semiconductor devices and method of forming the same

A method for forming a semiconductor memory structure includes forming an MTJ stack over a substrate. The method also includes etching the MTJ stack to form an MTJ device. The method also includes depositing a metal layer over a top surface and sidewalls of the MTJ device. The method also includes oxidizing the metal layer to form an oxidized metal layer. The method also includes depositing a cap layer over the oxidized metal layer. The method also includes oxidizing the cap layer to form an oxidized cap layer. The method also includes removing an un-oxidized portion of the cap layer.

In a method of manufacturing a semiconductor device, a cell structure is formed. The cell structure includes a bottom electrode, a magnetic tunnel junction (MTJ) stack disposed on the bottom electrode and a hard mask layer disposed on the MTJ stack. A first insulating cover layer is formed over sidewall of the MTJ stack. A second insulating cover layer is formed over the first insulating cover layer and the hard mask layer. A first interlayer dielectric (ILD) layer is formed. The hard mask layer is exposed by etching the first ILD layer and the second insulating cover layer. A second ILD layer is formed. A contact opening is formed in the second ILD layer by patterning the second ILD layer and removing the hard mask layer. A conductive layer is formed in the contact opening so that the conductive layer contacts the MTJ stack.

Magnetic random access memory and manufacturing method thereof

Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a first source/drain feature and a second source/drain feature, a first metal line disposed in a first dielectric layer and electrically connected to the first source/drain feature, a second metal line disposed in the first dielectric layer and electrically connected to the second source/drain feature, and a first memory element disposed over the first dielectric layer and electrically connected to the first source/drain feature by way of the first metal line. A width of the first metal line is different from a width of the second metal line. By changing the widths of the first metal line and the second metal line, a source line series resistance of a semiconductor device can be advantageously reduced without changing a pitch of two metal lines.

Structure and method for MRAM devices

A semiconductor device includes a bottom electrode; a magnetic tunneling junction (MTJ) element over the bottom electrode; a top electrode over the MTJ element; and a sidewall spacer abutting the MTJ element, wherein at least one of the bottom electrode, the top electrode, and the sidewall spacer includes a magnetic material.

A semiconductor package includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first semiconductor substrate, a first bonding structure and a memory cell. The second semiconductor device is stacked over the first semiconductor device. The second semiconductor device includes a second semiconductor substrate, a second bonding structure in a second dielectric layer and a peripheral circuit between the second semiconductor substrate and the second bonding structure. The first bonding structure and the second bonding structure are bonded and disposed between the memory cell and the peripheral circuit, and the memory cell and the peripheral circuit are electrically connected through the first bonding structure and the second bonding structure.

Semiconductor packages and method of manufacturing the same

Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a dielectric layer including a top surface, a plurality of magneto-resistive memory cells disposed in the dielectric layer and including top electrodes, a first etch stop layer disposed over the dielectric layer, a common electrode extending through the first etch stop layer to be in direct contact with the top electrodes, and a second etch stop layer disposed on the first etch stop layer and the common electrode. Top surfaces of the top electrodes are coplanar with the top surface of the dielectric layer.

MRAM structure for balanced loading

A method for manufacturing a memory device includes forming a via trench in a substrate and forming a via in the via trench. A lower portion of the via includes a first metal and an upper portion of the via includes a second metal that is different from the first metal. The method further includes forming a magnetic tunneling junction over the via and forming a top electrode over the magnetic tunneling junction.

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Hsinchu, Taiwan

Liang-Wei Wang