Ppg Industries Ohio, Inc.

Liang Ma

Masayuki Nakajima

Hong Li

Cynthia Kutchko

Calum Hugh Munro

Lorraine Melody Hsu

Gobinda Saha

Allison G Condie

Marvin Michael Pollum, Jr

Eric S Epstein

Maria S French

Shuyu Fang

Disclosed is a composition comprising an electrophile, a nucleophile, and a thermally conductive filler package. The filler package may comprise thermally conductive, electrically insulative filler particles that may have a thermal conductivity of at least 5 W/m·K (measured according to ASTM D7984) and a volume resistivity of at least 10 Ω·m (measured according to ASTM D257, C611, or B193) and that may be present in an amount of at least 90% by volume based on total volume of the filler package. The thermally conductive filler package may be present in an amount of at least 10% by volume percent based on total volume of the composition. The present invention also is directed to a method for treating a substrate and to substrates comprising a layer formed from a compositions disclosed herein.

Compositions containing thermally conductive fillers

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Allison Park, PA, United States of America

Liang Ma