Hon Hai Precision Industry Co., Ltd.

Hong-fu Jin Precision Industry (shenzhen) Co., Ltd.

Liang-Liang Cao

Hui Zhang

Yu-Hsu Lin

Lei Guo

Jeng-Da Wu

Liang-Qing Shan

Zhi-Ping Wu

A heat dissipation assembly for dissipating heat from a first heat source and a second heat source includes a heat sink, a fan, a supporting member, and a deflecting panel. The heat sink includes a base and a plurality of heat dissipation fins disposed on the base. The base is in contact with the first heat source for thermally conducting the heat generated by the first heat source. The fan and the supporting member are attached at opposite sides of the heat dissipation fins. The supporting member is a pivotable rod. The deflecting plate is attached to the pivotable rod and is pivotable relative to the heat dissipation fins. The deflecting plate is capable of deflecting airflow from the fan towards the second heat source to dissipate heat generated by the second heat source.

Heat dissipation assembly with pivotable deflecting plate

A heat dissipation apparatus includes a heat sink configured to contact a heat source, and a fan mounted on the heat sink configured to generate airflow through the heat dissipation apparatus. The fan includes a plurality of fan blades, and a motor configured for rotating the fan. The motor is located a distance from the fan blades.

Heat dissipation apparatus

A heat dissipating assembly includes a heat generating component, a heat sink, and a fan. The heat sink includes a base attached on the heat generating component and a plurality of fins attached on the base. The fan is attached to a top surface of the fins. The top surface of the fins is wider than the base. The fins incline inwardly from the top surface to the base for gathering cooling air from the fan to the base.

Heat dissipating assembly

A heat dissipation apparatus for dissipating heat from two heat sources includes a heat sink, and a fan mounted on the heat sink. The heat sink includes a base and a plurality of parallel fins positioned on the base, the base contacts with one of the two heat sources for thermally conducting the heat generated by the one of the two heat sources. The fan is configured to generate airflow through the fins in such a manner that airflow flows from a second side of the fins to a first side of the fins. A deflecting member is mounted on the first side of the fins for deflecting airflow from the fan towards the second of the two heat sources.

A computer enclosure includes a chassis with a plurality of heat generating components installed therein and an airflow guide structure. The airflow guide structure includes a fan and a duct attached to the fan. A pair of airflow outlets aligned with the fan is defined in the duct. The duct includes a plurality of pivot panels pivotally attached at airflow outlets. The pivot panels are configured to guide airflow from the fan to different positions of heat generating components in the chassis.

Computer enclosure with airflow guide

An electronic apparatus includes an enclosure (), a circuit board (), a fan module (), and an air guiding element () mounted in the enclosure. The circuit board includes at least one heat generating component () thereon. The fan module has a fan () and an output opening () corresponding to the fan. The air guiding element comprises a resisting panel () and a guiding panel () comprises a free end that extends toward the output opening of the fan module. The at least one heat generating component and the output opening are on the same side of the resisting panel. The guiding panel defines a free end () and a connecting end () connecting the resisting panel. A plane defined by the ends of the guiding panel is aligned at an angle larger than 90 degrees relative to the resisting panel.

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Shenzhen, China

Liang-Liang Cao