Unistars Corporation

Liang-Kuei Huang

Shang-Yi Wu

Pao-Ya Wang

An optoelectronic package includes a carrier, a light emitting die, a cover, and an encapsulation material. The carrier has a carrying plane and a wiring layer on the carrying plane. The light emitting die is mounted on the carrying plane and electrically connected to the wiring layer. The cover is connected to carrier. A cavity is formed between the cover and the carrier, and the light emitting die is within the cavity. The encapsulation material formed on the carrier surrounds the cover. The encapsulation material completely covers the interface between the cover and carrier.

Optoelectronic package with a low water vapor transmission rate (WVTR) and method for fabricating the same

A light emitting package base structure includes a carrier, a light emitting chip, a light transmission unit and a dam. The carrier has a supporting surface and an outer surface surrounding the supporting surface. The light emitting chip is disposed on the supporting surface and electrically connected to the carrier. The light transmission unit is disposed on the carrier and has a through hole. The dam is disposed between the carrier and the light transmission unit, and a hermetic receiving space is formed between the dam, the light transmission unit and the carrier. The light emitting chip is located in the hermetic receiving space and the dam has a side surface away from the hermetic receiving space. A gap is formed between the side surface and the outer surface, and the through hole is corresponded to a location between the side surface and the outer surface.

Growing community of inventors

Taipei, Taiwan

Liang-Kuei Huang