Boe Technology Group Co., Ltd.

Chongqing Boe Optoelectronics Technology Co., Ltd.

Hefei Boe Optoelectronics Technology Co., Ltd.

Chengdu Boe Optoelectronics Technology Co., Ltd.

Beijing Boe Technology Development Co., Ltd.

Hefei Boe Ruisheng Technology Co., Ltd.

Beijing Boe Optoelectronics Technology Co., Ltd.

Beijing Baidu Netcom Science and Technology Co., Ltd.

Siemens Aktiengesellschaft

Beijing Jiaotong University

Beijing Summer Sprout Technology Co. Ltd.

Hefei Boe Pixey Technology Co., Ltd.

Siemens Ltd., China

Liang Gao

Hai Tang

Sijun Lei

Bing Zhang

Jianwei Qin

Xiaolin Geng

Yansheng Sun

Lu Gao

Xianyong Gao

Bo Han

Yuxu Geng

Bin Wang

Hao Sun

Xiaoxia Huang

Shanbin Chen

Dengqian Li

Ajuan Du

Hufei Yang

Enjian Yang

Feifan Li

Jing Wang

Lu Yu

Song Liu

Xiao Wang

Jian Sang

Xu Lu

Shuang Zhang

Junjie Ma

Yunsong Li

Fanjian Zeng

Hebing Ma

Chaojie Zhang

Jingbin Jie

Dong Wang

Haiwei Sun

Zhicai Xu

Gongtao Zhang

Bo Ran

Yong Long

Sen Tan

Shuanhu Di

Jian Ye Chen

Heling Zhu

Chuanjun Xia

Yang Wang

Qiang Li

Lei Zhang

Fei Shang

Ming Zhai

Wencheng Luo

Hui Yin

Wei Fu

Hong Xiao

Xiangchao Chen

Yongle Wang

Qi Qi

Haijun Qiu

Peng Wu

Xinyu Wang

Zhao Zhang

Jian Ouyang

Chi Yuen Raymond Kwong

Shuai Hou

Peng Sun

Yong Hu

Meng Xu

Wei Dai

Ji Wang

Qian Qian

Jie Han

Shubai Zhang

Qiang Yu

Hang Min

Wei Huang

Siqing Fu

Bing Ji

Pengfei Cheng

Xing Liu

Bowen Xiao

Teng Zhang

Yupeng Li

Yuanda Lu

Xiujun Cai

Fei Peng

Xuerui Gong

Yezhou Tan

Fengping Wu

Xiaopan Che

Jia Sun

Ying Yang

Huiqing Pang

Dongmei Xie

Huan Wu

Qizhong Chen

Yong Deng

Yu Kai Ji

Yongli Ge

Guanghe Ma

Jiwei Sun

The system includes a track lining apparatus and two tamping apparatuses arranged in parallel, wherein the track lining apparatus includes two track lining hydro-cylinders, and the track lining hydro-cylinder communicates with a hydraulic control system through an oil inlet pipeline and an oil return pipeline; pressure sensors configured to detect pressures of the pipelines are provided on the oil inlet pipeline and the oil return pipeline; the tamping apparatus includes two pairs of tamping components arranged on both sides, where the tamping component includes a pair of packer arms and two pairs of packers; a dynamic force sensor is provided at a joint between the packer arm and the packer, and the dynamic force sensor can detect a transient dynamic downward insertion force generated when the packer is inserted into the ballast bed.

Real-time detecting system for the mechanical quality state of ballast bed based on tamping car

The present application provides a light emitting panel, a preparation method thereof, and a light emitting apparatus, which relate to the field of display technology. The light emitting panel includes a base; a reflective layer located on a side of the base, the reflective layer includes a plurality of grooves arranged in an array; a plurality of devices located in the grooves and electrically connected to the base; a first optical film located on a side of the reflective layer facing away from the base, the orthographic projection of the first optical film on the base covers the orthographic projection of the reflective layer on the base, and at least partial areas of the reflective layer are in direct contact with the first optical film.

Light emitting panel, preparation method thereof, and light emitting apparatus

A circuit board structure and a display device, the circuit board structure includes a first circuit board, a second circuit board, a filling portion and an electromagnetic shield layer. The second circuit board has a thickness greater than that of the first circuit board. At least one corner portion forms at a joint of the first circuit board and the second circuit board. A connection line forms at a joint of the second circuit board and the first circuit board. The connection line is located at the corner portion. The filling portion fills the corner portion, an extending direction of the filling portion is identical to an extending direction of the corner portion. The extending direction is identical to a direction of the connection line. A thickness of a cross section of the filling portion perpendicular to the extending direction increases as a distance from the second circuit board decreases.

Circuit board structure and display device

A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.

Light-emitting substrate and method of manufacturing the same, backlight module and display apparatus

A light-emitting substrate includes a back plate, light-emitting regions arranged in an array and a bonding electrode group. The light-emitting regions are disposed on the back plate, and each light-emitting region is provided with at least one light-emitting group therein. The bonding electrode group is disposed on the back plate and includes a first bonding electrode and remaining bonding electrodes. A second power supply voltage terminal of a light-emitting group is electrically connected to a feedback signal line included in the light-emitting substrate, and the first bonding electrode is electrically connected to the feedback signal line. An impedance between the first bonding electrode and an adjacent one of the remaining bonding electrodes is larger then an impedance between two adjacent and consecutive ones of the remaining bonding electrodes.

Light-emitting substrate, backlight module and display apparatus

The present application provides an array base plate and a detecting method thereof, and a light emitting apparatus, which relates to the technical field of displaying. The array base plate includes: a substrate, wherein the substrate includes a plurality of first light transmitting areas; and a first conductive layer located on the substrate; the first conductive layer includes a plurality of conductive-pad groups, and each of the conductive-pad groups includes at least one conductive pad; an overlapping area exists between an orthographic-projection area of the conductive pad on the substrate and one of the first light transmitting areas; and a transmittance of parts of the substrate that are located at the first light transmitting areas is greater than or equal to a first preset value.

Array base plate and detecting method thereof, and light emitting apparatus

A light-emitting substrate includes a circuit board, a plurality of light-emitting devices, a reflective layer and a support layer. The plurality of light-emitting devices are disposed on the circuit board. The reflective layer is disposed on the circuit board; the reflective layer is provided with a plurality of openings therein, and a light-emitting device is located in an opening. The support layer is disposed on a side of the circuit board away from the reflective layer.

Light-emitting substrate and manufacturing method thereof, backlight module and display apparatus

A heat dissipation film for a display module, and a preparation method of a display device. The heat dissipation film comprises a composite structure layer and a removable protective film disposed on the composite structure layer. The composite structure layer has a first side surface and a second side surface disposed opposite to each other, and is provided with a preconfigured hole passing through the first side surface and the second side surface. The first side surface of the composite structure layer adheres to a side of the display module facing away from a display side. The protective film is attached to the second side surface of the composite structure layer. The protective film is provided with a shielding region covering the preconfigured hole. The shielding region and the rest of the protective film can all be independently torn off from the composite structure layer.

Heat dissipation film for display module, and preparation method of display device

A backlight module includes a substrate provided with a light-emitting region and a bonding region, a plurality of light-emitting units disposed on a side of the substrate, a back plate disposed on the other side of the substrate, and at least three drive circuit boards bonded and connected to the bonding region by first connectors. Moreover, an extension direction of a long edge of each of the light-emitting units is not parallel to a bonding edge of the bonding region. In this way, when the back plate is a curved back plate, the risk of peeling of the light-emitting units from the substrate when the back plate is in a curved state can be reduced by flexibly setting the degree of the included angle between the extension direction of each long edge of each light-emitting unit and the bonding edge of the bonding region.

Backlight module, method for manufacturing the same, and display apparatus

A backplane includes a substrate, a circuit structure layer, a reflective layer, a plurality of electronic devices and a plurality of encapsulation portions. Each encapsulation portion covers an electronic device in the plurality of electronic devices. At least one first conductive line includes a first linear extending portion, a second linear extending portion and a third linear extending portion that are sequentially connected. Orthographic projections of the first linear extending portion, the second linear extending portion, the third linear extending portion and an encapsulation portion in the plurality of encapsulation portions on the substrate are respectively a first orthographic projection, a second orthographic projection, a third orthographic projection and a fourth orthographic projection. The first orthographic projection is located within the fourth orthographic projection, the second orthographic projection is partially overlapped with the fourth orthographic projection, and the third orthographic projection is located outside the fourth orthographic projection.

Backplane and method for manufacturing the same, backlight module, and display apparatus

The present disclosure relates to a composition, a substrate and a preparation method of a light reflection layer. The composition comprises: a matrix material and an additive, the matrix material including a solvent, reactant molecules and a material with reflection function dispersed in the solvent, wherein the reactant molecules is capable of undergoing cross-linking reaction under a first preset condition, and include monomer molecules and/or prepolymer molecules; the additive including a filler material that is in the form of powder or microspheres, capable of being dispersed in the matrix material, and filled between the crosslinking points of any adjacent reactant molecules to block the crosslinking reaction of some adjacent reactant molecules under the first preset condition.

Composition, substrate and preparation method of light reflection layer

The present application provides a virtual reality-based derailment accident passenger comfort degree monitoring system and method, wherein the system comprises a train dynamics calculation module, a train operation state virtual simulation module, a six-degree-of-freedom motion platform, a train seat, a head-mounted display, a human body monitoring sensor system and a monitoring data storage terminal. The system establishes a database of the injury degrees of passengers with different ages under the train derailment; the test cost is low, the safety coefficient is high, and the repeatability of the test conditions is good, wherein the comfort degree test data of the passengers under the same derailment inducement can be repeatedly obtained; the safety risk in the actual test is eliminated, so that the authenticity of the test result is ensured, and the test cost is low and the repeatability is high.

Virtual reality-based derailment accident passenger comfort degree monitoring system and method

A flexible support plate is configured to support a display panel, and is provided with a bendable region. The bendable region has at least one boundary line extending in a first direction, and the boundary line is part of a side of the flexible support plate. A plurality of hollows are arranged at intervals in the bendable region, the plurality of hollows are divided into a plurality of hollow groups arranged in the first direction, and each hollow group includes at least one hollow. For any boundary line, any one of the plurality of hollow groups has one boundary point, the boundary point is disposed on a contour line of a hollow in the hollow group to which the boundary point belongs, and the boundary point has a smallest distance from a corresponding boundary line in the contour line to which the boundary point belongs.

Flexible support plate, and method for manufacturing same

Disclosed in embodiments of the present disclosure are a flexible circuit board assembly, a display assembly and a display device. The flexible circuit board assembly includes: a first flexible circuit board, including a component part, the component part being provided with components; and a first wave absorbing layer, disposed on the component part and configured to cover the components. The display assembly includes a display module and the flexible circuit board assembly; the display module includes a module body and a second binding part, and the second binding part is configured to be bent to a back surface of the module body; and the first flexible circuit board is located on the back surface of the module body and includes a first binding part, and the first binding part is bound and connected to the second binding part of the display module.

Flexible circuit board assembly, display assembly and display device

The present disclosure provides a peep-proof film, the peep-proof film includes a light-transmitting film body, an electrophoretic liquid, a first electrode pattern and a second electrode pattern, the film body includes a light incident surface and a light exit surface which are opposite to each other, the first electrode pattern and the second electrode pattern are spaced in a thickness direction of the peep-proof film, the film body has a plurality of receiving cavities thereinside, the electrophoretic liquid is in the receiving cavities, the electrophoretic liquid is located between the first electrode pattern and the second electrode pattern and includes a dispersion medium and electrophoretic particles, and a refractive index of the dispersion medium is less than that of the film body. The present disclosure further provides a backlight source and a display device.

Peep-proof film, backlight source and display device

Growing community of inventors

Beijing, China

Liang Gao