Chartered Semiconductor Manufacturing Ltd (corporation)

Globalfoundries Singapore Pte. Ltd.

Liang-Choo Hsia

Sia Kim Tan

Qunying Lin

Jeffrey C Lam

Huang Liu

Pradeep Yelehanka

Denise Tan

Chung Meng Lek

Thomas Thiam

Zhao Lun

Johnny Widodo

Soon Yoeng Tan

Wuping Liu

Huey Ming Chong

Beichao Zhang

Juan Boon Tan

Purakh Raj Verma

Hong Yu

Yung Fu Chong

Jae Gon Lee

Guowei Zhang

Kin Leong Pey

Chim Seng Seet

Yeow Kheng Lim

Bei Chao Zhang

Chung Woh Lai

Tae Jong Lee

Chew Hoe Ang

Dong Kyun Sohn

Yun Ling Tan

Gek Soon Chua

Shailendra Mishra

Alex K H See

Zhihong Mai

Meisheng Zhou

James Yongmeng Lee

Pik Kee Tan

Wenzhi Gao

Feng Zhao

Yasri Yudhistira

Suey Li Toh

Xianbin Wang

Teck Jung Tang

A method of manufacture of an integrated circuit system includes: providing a substrate including an active device; forming a through-silicon-via into the substrate; forming an insulation layer over the through-silicon-via to protect the through-silicon-via; forming a contact to the active device after forming the insulation layer; and removing the insulation layer.

Integrated circuit system with through silicon via and method of manufacture thereof

A method of manufacture of an integrated circuit system includes: forming an etch stop layer over a bulk substrate; forming a buffer layer on the etch stop layer; forming a hard mask on the buffer layer; forming a through silicon via through the etch stop layer with the hard mask detected and the buffer layer removed with a low down force; and forming a passivation layer on the through silicon via and the etch stop layer.

Integrated circuit system with via and method of manufacture thereof

A method for manufacturing an integrated circuit system includes: providing a first material; forming a second material over a first side of the first material; and exposing a second side of the first material to an energy source to form an electrical contact at an interface of the first material and the second material.

Integrated circuit system employing backside energy source for electrical contact formation

A method and structure for removing side lobes is provided by positioning first and second radiation transparent regions of respective first and second phases at a first plane with the first and second phases being substantially out of phase. Further, positioning the first and the second region to cause radiation at a second plane to be neutralized in a first region, not to be neutralized in a second region, and to have a side lobe in a third region. Further, positioning a non-transparent region at the first plane to assure radiation at the second plane to be neutralized in the first region and positioning a third radiation transparent region of the first or second phase at the first plane to neutralize the side lobes in the third region at the second plane.

Method and apparatus for removing radiation side lobes

Method of manufacture an integrated circuit system with through silicon via

An integrated circuit system that includes: providing a substrate; depositing a dielectric on the substrate; depositing an isolation dielectric on the dielectric; forming a trench through the isolation dielectric and the dielectric to expose the substrate; depositing a dielectric liner over the integrated circuit system; processing the dielectric liner to form a trench spacer; and depositing an epitaxial growth within the trench that includes a crystalline orientation that is substantially identical to the substrate.

Integrated circuit system employing selective epitaxial growth technology

An integrated circuit processing system is provided including providing a substrate having an integrated circuit, forming an interconnect layer over the integrated circuit, applying a low-K dielectric layer over the interconnect layer, applying an ultra low-K dielectric layer over the low-K dielectric layer, forming an opening through the ultra low-K dielectric layer and the low-K dielectric layer to the interconnect layer, depositing an interconnect metal in the opening, and chemical-mechanical polishing the interconnect metal and the ultra low-K dielectric layer.

Integrated circuit processing system

A phase shifting photolithography system includes inserting a phase shift component in a path of an illumination, wherein the phase shift component modifies a portion of the illumination to a different, and controlling an aperture shutter of the phase shift component modifying an interference of the illumination and the illumination with the different phase.

Phase shifting photolithography system

A semiconductor processing system with ultra low-K dielectric is provided including providing a substrate having an electronic circuit, forming an ultra low-K dielectric layer, having porogens, over the substrate, blocking an incoming radiation from a first region of the ultra low-K dielectric layer, evaporating the porogens from a second region of the ultra low-K dielectric layer by projecting the incoming radiation on the second region, and removing the ultra low-K dielectric layer in the first region with a developer.

Semiconductor processing system with ultra low-K dielectric

A polarizing photolithography reticle system is provided including providing a reticle substrate, forming polarization structures on the reticle substrate, and etching circuit patterns on the reticle substrate on a side opposite the polarization structures.

Polarizing photolithography system

A method for forming a contact hole unit cell is provided. A light transparent contact hole region of a first phase is positioned at a first plane. A light transparent phase-shifting region of a second phase is positioned at the first plane, the second phase being substantially out of phase with the first phase. The phase-shifting region substantially surrounds the contact hole region. A light transparent border region is positioned at the first plane outside the phase-shifting region. The border region has a phase substantially the same as that of the contact hole region. A chrome pad is positioned at the first plane outside and contacting at least a portion of the border region. The contact hole region, the phase-shifting region, the border region, and the chrome pad are positioned to cause light from the first plane to be reinforcing in a target contact hole configuration on a second plane and to be substantially neutralizing outside the target contact hole configuration on the second plane.

Method and apparatus for contact hole unit cell formation

A embodiment method for forming a layout for a phase shift mask. A embodiment comprises providing a layout comprising a first feature, a first shifter region and a second shifter region. The first feature preferably has a L-shape portion with an elbow region. The first shifter region is on the outside of the L-shaped portion and the second shifter region is on the inside of the L-shaped portion. The elbow region has an outside corner away from the second shifter region. We identify a phase conflict region caused by the L-shaped portion of the first feature, the first shifter region and the second shifter region. We resolve the phase conflict by modifying the elbow region by moving the outside corner of the elbow region away from the first shifter region and the phase conflict region. The modification of the elbow region further comprises forming a jog region in the line end section of the first feature.

Method to resolve line end distortion for alternating phase shift mask

A semiconductor design is provided having at least one feature at one of a line end and a line junction, and phase regions. At least one cut line is added to at least one of such features at line ends and such features at line junctions. Phases are assigned to the phase regions. The manufacturing of a photomask with the assigned phase regions is directed.

System and method for phase shift assignment

A method for fabricating a phase shift mask is provided. A trenched phase shift mask having portions of a light-blocking layer thereon is formed. A layer of anti-reflective material is then formed on the trenched phase shift mask and the portions of the light-blocking layer. The anti-reflective material is then removed on horizontal surfaces of the trenched phase shift mask and of the portions of the light-blocking layer.

Anti-reflective sidewall coated alternating phase shift mask and fabrication method

Growing community of inventors

Singapore, Singapore

Liang-Choo Hsia