Micron Technology Incorporated

Texas Instruments Corporation

Liang Chee Tay

See Hiong Leow

Toh Kok Seng

Kay Kit-Tan

Tiang Hock Lim

Packaged microelectronic devices and methods of manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a method of manufacturing a microelectronic device includes forming a stand-off layer over a plurality of microelectronic dies on a semiconductor workpiece, and removing selected portions of the stand-off layer to form a plurality of stand-offs with the individual stand-offs positioned on a backside of a corresponding die. The method further includes cutting the semiconductor workpiece to singulate the dies, and attaching the stand-off on a first singulated die to a second die.

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films for separating the molded components from the mold cavities. The molding apparatus also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto the release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together. A molding method includes the steps of providing the molding apparatus, placing the release films in the mold cavities, clamping the release films to one of the mold chases, and then injecting the molding compound into the mold cavities.

Method for molding semiconductor components

An apparatus for the fabrication of a semiconductor device comprising: a mold having top and bottom halves, each with cavities for holding semiconductor chips pre-assembled on an electrically insulating interposer; one of said halves having a plurality of runners and a plurality of gates for feeding encapsulation material into said cavities; said plurality of runners comprising pairs of runners parallel to each other, having gates opposite to each other, thereby forming dual gates; each pair of runners being configured such that encapsulation material will exit from adjacent gates concurrently; and each pair of dual gates being structured such that they fill the cavity between them uniformly with encapsulation material, thereby encapsulating thin semiconductor devices.

Method of encapsulating thin semiconductor chip-scale packages

A molding apparatus for molding semiconductor components includes a pair of opposing mold chases having mating mold cavities. The mold cavities are configured to retain polymer release films and also includes a movable pot having a reservoir for retaining a preform of molding compound, and a plunger for moving the molding compound into the mold cavities. The movable pot is mounted for axial movement within a chamfered opening in one of the mold chases. The movable pot is configured to clamp onto release films to prevent wrinkling of the release films, and seepage of the molding compound under the release films. A system for molding semiconductor components includes the molding apparatus, a pot drive mechanism for moving the movable pot, a plunger drive mechanism for moving the plunger, and a clamping mechanism for clamping the mold chases together.

Apparatus for molding semiconductor components

A method of encapsulating a semiconductor device comprising the steps of providing a mold having top and bottom halves each with cavities for holding semiconductor devices, and further having gates and runners for feeding encapsulation material into said cavities; lining said cavities with protective plastic films; providing a plurality of semiconductor integrated circuit chips, each having an outline; providing an electrically insulating interposer; assembling said chip and said interposer, loading said assembly into said mold and introducing into said mold a low-viscosity, high adhesion encapsulation material; at least partially curing said encapsulation material, thereby forming a flat, high-luster surface; opening said mold and removing said interposer together with said encapsulated chips from said mold; attaching an array of solder balls to the exposed surface of said interposer; and singulating said encapsulated semiconductor devices, thereby forming devices having an outline substantially the same as said outline of said chips.

Growing community of inventors

Singapore, Singapore

Liang Chee Tay