Molex Corporation

Google Inc.

Google Technology Holdings LLC

Li Zhuang

Hazelton P Avery

Scott D Sommers

Andrew Kolak

Pu Xie

Dominic Steier

John C Laurx

Teng-Kai Chen

Chia Hung Mou

Jerry Shubert

Daniel Wenzel

Philip J Dambach

Sen Yang

Ross W Ripley

High-speed connectors and connector assemblies that include structures for alignment and/or improved thermal performance. In one example, a connector assembly, comprising: a housing comprising a port; a wafer assembly with contacts positioned in the port of the housing, the wafer assembly comprising a row of conductors, the row of conductors comprising a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors, wherein each communication signal conductor is positioned next to a ground conductor among the plurality of ground conductors in the row of conductors; and a ground path assembly comprising the plurality of ground conductors, a conductive ground shield, and a metal ground shield insert that is stitch mated with the conductive ground shield.

Shielded connector assemblies with temperature and alignment controls

Examples of connectors, connector assemblies, and wafer assemblies for improved shielding and thermal performance are described. In one example, a wafer assembly includes a ground path assembly and a row of conductors. The ground path assembly includes a first ground shield and a second ground shield. The row of conductors includes a plurality of communication signal conductors and a plurality of ground conductors arranged in the row of conductors. The first ground shield extends along a first pair of communication signal conductors among the plurality of communication signal conductors and the second ground shield extends along a second pair of the communication signal conductors among the plurality of communication signal conductors.

A connector assembly includes an insulative housing, first and second conductive ground wafers (see e.g.,and) and a plurality of grounding links. The insulative housing has a plurality of conductive signal terminals disposed therein (see e.g.,). The insulative housing has opposite side surfaces and a plurality of openings therein extending between the side surfaces. The second ground wafer is spaced from and parallel to the first ground wafer. The grounding links are electrically connected to one of the ground wafers and extend towards another of the ground wafers and extend through the openings in the housing.

High density receptacle

Various examples of high speed connectors and connector assemblies that use connector side plate designs and include structures for improved thermal performance are described. In one example, a connector assembly includes a housing, a side plate on one side of the housing, and a wafer assembly that includes a row of conductors and a protrusion, with the protrusion being located at one end of the row of conductors. The side plate can include an aperture, and the protrusion can be inserted into the aperture to align the row of conductors.

A connector assembly is provided, which includes a cage that defines a port and a card slot positioned in the port. Also included is a wafer set aligned with the card slot, the wafer set including a plurality of wafers that each support at least four terminals. The terminals are arranged so that two rows of contacts are provided, one row on a first side and one row on a second side of the card slot. Each wafer of the plurality of wafers includes an insulative frame, each terminal includes a beam portion cantilevered from the insulative frame supporting that terminal, and the cantilevered beam portion of at least one terminal of the at least four terminals has a molded material thereon.

A device () includes a display () that is suitable for use under widely ranging lighting conditions. The display includes separately operable transmissive light modulator subpixels () that can be provided in at least three colors to provide a full color display but also includes separately operable reflective light modulator subpixels () that provide basic readability when light levels are so high (e.g., bright summer day) that the image presented by the transmissive light modulators would be difficult to discern. The reflective light modulators may be provided with in-pixel memory () so as to reduce the energy cost of providing always-on functioning for displaying certain time sensitive information.

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Long Grove, IL, United States of America

Li Zhuang